參數(shù)資料
型號(hào): AD5441BRMZ
廠(chǎng)商: Analog Devices Inc
文件頁(yè)數(shù): 6/17頁(yè)
文件大?。?/td> 0K
描述: IC DAC 12BIT SERIAL IN 8MSOP
產(chǎn)品培訓(xùn)模塊: Data Converter Fundamentals
DAC Architectures
標(biāo)準(zhǔn)包裝: 50
設(shè)置時(shí)間: 500ns
位數(shù): 12
數(shù)據(jù)接口: 串行
轉(zhuǎn)換器數(shù)目: 1
電壓電源: 單電源
功率耗散(最大): 55µW
工作溫度: -40°C ~ 125°C
安裝類(lèi)型: 表面貼裝
封裝/外殼: 8-TSSOP,8-MSOP(0.118",3.00mm 寬)
供應(yīng)商設(shè)備封裝: 8-MSOP
包裝: 管件
輸出數(shù)目和類(lèi)型: 1 電流,單極;1 電流,雙極
采樣率(每秒): *
產(chǎn)品目錄頁(yè)面: 782 (CN2011-ZH PDF)
配用: EVAL-AD5541/42EBZ-ND - BOARD EVAL FOR AD5441/2
AD5441
Rev. A | Page 13 of 16
OUTLINE DIMENSIONS
02
28
08
-B
TOP VIEW
8
1
5
4
0.35
0.30
0.25
*EXPOSED
PAD
(BOTTOM VIEW)
PIN 1 INDEX
AREA
3.00
BSC SQ
SEATING
PLANE
0.80
0.75
0.70
0.20 REF
0.05 MAX
0.02 NOM
0.80 MAX
0.55 NOM
1.74
1.64
1.49
2.48
2.38
2.23
0.50
0.40
0.30
0.65 BSC
PIN 1
INDICATOR
(R 0.2)
*FOR PROPER CONNECTION OF THE EXPOSED PAD PLEASE REFER TO
THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION
OF THIS DATA SHEET.
Figure 25. 8-Lead Lead Frame Chip Scale Package [LFCSP_WD]
3 mm × 3 mm Body, Very Very Thin, Dual Lead
(CP-8-3)
Dimensions are shown in millimeters
COMPLIANT TO JEDEC STANDARDS MO-187-AA
0.80
0.60
0.40
4
8
1
5
PIN 1
0.65 BSC
SEATING
PLANE
0.38
0.22
1.10 MAX
3.20
3.00
2.80
COPLANARITY
0.10
0.23
0.08
3.20
3.00
2.80
5.15
4.90
4.65
0.15
0.00
0.95
0.85
0.75
Figure 26. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions are shown in millimeters
ORDERING GUIDE
INL (LSB)
Temperature Range
Package Description
Package Option
Branding
AD5441BCPZ-R2
±0.5
40°C to +125°C
8-Lead LFCSP_WD
CP-8-3
DBD
AD5441BCPZ-REEL7
±0.5
40°C to +125°C
8-Lead LFCSP_WD
CP-8-3
DBD
AD5441BRMZ
±0.5
40°C to +125°C
8-Lead MSOP
RM-8
DBC
AD5441BRMZ-REEL7
±0.5
40°C to +125°C
8-Lead MSOP
RM-8
DBC
1 Z = RoHS Compliant Part.
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