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    參數(shù)資料
    

    


    


    
型號(hào)：
AD5570BRS-REEL7

    

    
廠商：
Analog Devices Inc

    

    
文件頁(yè)數(shù)：
13/24頁(yè)

    

    
文件大?。?/td>
0K

    

    
描述：
IC DAC 16BIT SERIAL IN 16SSOP

    

    
產(chǎn)品培訓(xùn)模塊：
Data Converter Fundamentals
    
	DAC Architectures
    		

    

    
標(biāo)準(zhǔn)包裝：
500

    

    
設(shè)置時(shí)間：
12µs
    		

    

    
位數(shù)：
16
    		

    

    
數(shù)據(jù)接口：
串行
    		

    

    
轉(zhuǎn)換器數(shù)目：
1
    		

    

    
電壓電源：
雙 ±
    		

    

    
功率耗散（最大）：
150mW
    		

    

    
工作溫度：
-40°C ~ 85°C
    		

    

    
安裝類(lèi)型：
表面貼裝
    		

    

    
封裝/外殼：
16-SSOP（0.209"，5.30mm 寬）
    		

    

    
供應(yīng)商設(shè)備封裝：
16-SSOP
    		

    

    
包裝：
帶卷 (TR)
    		

    

    
輸出數(shù)目和類(lèi)型：
1 電壓，雙極
    		

    

    
采樣率（每秒）：
83k
    		

    

    

    

	
    
    
    

    
    
	
    AD5570
    Rev. C | Page 20 of 24
    Table 8. Partial List of Precision References Recommended
    for Use with the AD5570
    Part No.
    Initial
    Accuracy
    (mV max)
    Long-Term
    Drift
    (ppm typ)
    Temp Drift
    (ppm/
    °C max)
    0.1 Hz to
    10 Hz Noise
    (μV p-p typ)
    ADR435
    ±6
    30
    3
    3.4
    ADR425
    ±6
    50
    3
    3.4
    ±5
    50
    3
    15
    ADR395
    ±6
    50
    25
    5
    AD586
    ±2.5
    15
    10
    4
    1 Available in SC70 package.
    LAYOUT GUIDELINES
    In any circuit where accuracy is important, careful considera-
    tion of the power supply and ground return layout helps to
    ensure the rated performance. The printed circuit board that
    the AD5570 is mounted on is designed so the analog and dig-
    ital sections are separated and confined to certain areas of the
    board. If the AD5570 is in a system where multiple devices
    require an AGND-to-DGND connection, the connection is
    made at one point only. The star ground point is established
    as close as possible to the device.
    The AD5570 has ample supply bypassing of 10 μF in parallel
    with 0.1 μF on each supply located as close to the package as
    possible, ideally right up against the device. The 10 μF capacitors
    are the tantalum bead type. The 0.1 μF capacitor has low effective
    series resistance (ESR) and effective series inductance (ESI)
    such as the common ceramic types that provide a low imped-
    ance path to ground at high frequencies to handle transient
    currents due to internal logic switching.
    The power supply lines of the AD5570 use as large a trace as pos-
    sible to provide low impedance paths and reduce the effects of
    glitches on the power supply line. Fast switching signals such as
    clocks are shielded with digital ground to avoid radiating noise
    to other parts of the board, and are never be run near the refer-
    ence inputs. A ground line routed between the SDIN and SCLK
    lines reduces crosstalk between them; this is not required on a
    multilayer board that has a separate ground plane, but separating
    the lines helps. It is essential to minimize noise on the REFIN
    line because it couples through to the DAC output.
    Avoid crossover of digital and analog signals. Traces on opposite
    sides of the board must run at right angles to each other.
    This reduces the effects of feed through the board. A micro-
    strip technique is by far the best, but not always possible
    with a double-sided board. In this technique, the component
    side of the board is dedicated to ground plane, while signal
    traces are placed on the solder side.
    OPTO-ISOLATORS
    In many process control applications, it is necessary to provide
    an isolation barrier between the controller and the unit being
    controlled. Opto-isolators provide voltage isolation in excess of
    3 kV. The serial loading structure of the AD5570 makes it ideal
    for opto-isolated interfaces, because the number of interface lines
    is kept to a minimum. Figure 41 shows a 4-channel isolated inter-
    face to the AD5570. To reduce the number of opto-isolators, the
    LDAC pin can be tied permanently low if the simultaneous
    updating of the DAC is not required. The DAC can then be
    updated on the rising edge of SYNC.
    VCC
    TO SDIN
    TO SCLK
    TO SYNC
    SYNC OUT
    SERIAL CLOCK OUT
    SERIAL DATA OUT
    CONTROLLER
    OPTO-COUPLER
    TO LDAC
    CONTROL OUT
    03
    76
    0-
    05
    0
    Figure 41. Opto-Isolated Interface
    
    
    
    
    
    


    


    

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    相關(guān)代理商/技術(shù)參數(shù)
    		

    參數(shù)描述
    		

    
    

    
AD5570BRSZ
功能描述:IC DAC 16BIT SERIAL IN 16SSOP RoHS:是 類(lèi)別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:- 標(biāo)準(zhǔn)包裝:1 系列:- 設(shè)置時(shí)間:4.5µs 位數(shù):12 數(shù)據(jù)接口:串行，SPI? 轉(zhuǎn)換器數(shù)目:1 電壓電源:單電源 功率耗散（最大）:- 工作溫度:-40°C ~ 125°C 安裝類(lèi)型:表面貼裝 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:8-SOICN 包裝:剪切帶 (CT) 輸出數(shù)目和類(lèi)型:1 電壓，單極；1 電壓，雙極 采樣率（每秒）:* 其它名稱(chēng):MCP4921T-E/SNCTMCP4921T-E/SNRCTMCP4921T-E/SNRCT-ND

    

    
AD5570BRSZ-REEL
功能描述:IC DAC 16BIT SERIAL IN 16SSOP RoHS:是 類(lèi)別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:- 產(chǎn)品培訓(xùn)模塊:Data Converter Fundamentals
	DAC Architectures 標(biāo)準(zhǔn)包裝:750 系列:- 設(shè)置時(shí)間:7µs 位數(shù):16 數(shù)據(jù)接口:并聯(lián) 轉(zhuǎn)換器數(shù)目:1 電壓電源:雙 ± 功率耗散（最大）:100mW 工作溫度:0°C ~ 70°C 安裝類(lèi)型:表面貼裝 封裝/外殼:28-LCC（J 形引線） 供應(yīng)商設(shè)備封裝:28-PLCC（11.51x11.51） 包裝:帶卷 (TR) 輸出數(shù)目和類(lèi)型:1 電壓，單極；1 電壓，雙極 采樣率（每秒）:143k

    

    
AD5570BRSZ-REEL7
功能描述:IC DAC 16BIT SERIAL IN 16SSOP RoHS:是 類(lèi)別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:- 產(chǎn)品培訓(xùn)模塊:Data Converter Fundamentals
	DAC Architectures 標(biāo)準(zhǔn)包裝:750 系列:- 設(shè)置時(shí)間:7µs 位數(shù):16 數(shù)據(jù)接口:并聯(lián) 轉(zhuǎn)換器數(shù)目:1 電壓電源:雙 ± 功率耗散（最大）:100mW 工作溫度:0°C ~ 70°C 安裝類(lèi)型:表面貼裝 封裝/外殼:28-LCC（J 形引線） 供應(yīng)商設(shè)備封裝:28-PLCC（11.51x11.51） 包裝:帶卷 (TR) 輸出數(shù)目和類(lèi)型:1 電壓，單極；1 電壓，雙極 采樣率（每秒）:143k

    

    
AD5570WRS
功能描述:IC DAC 16BIT SRL-IN/VOUT 16-SSOP RoHS:否 類(lèi)別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:- 產(chǎn)品培訓(xùn)模塊:Data Converter Fundamentals
	DAC Architectures 標(biāo)準(zhǔn)包裝:750 系列:- 設(shè)置時(shí)間:7µs 位數(shù):16 數(shù)據(jù)接口:并聯(lián) 轉(zhuǎn)換器數(shù)目:1 電壓電源:雙 ± 功率耗散（最大）:100mW 工作溫度:0°C ~ 70°C 安裝類(lèi)型:表面貼裝 封裝/外殼:28-LCC（J 形引線） 供應(yīng)商設(shè)備封裝:28-PLCC（11.51x11.51） 包裝:帶卷 (TR) 輸出數(shù)目和類(lèi)型:1 電壓，單極；1 電壓，雙極 采樣率（每秒）:143k

    

    
AD5570WRS-REEL
 制造商:Analog Devices 功能描述:DAC 1-CH R-2R 16-bit 16-Pin SSOP T/R 制造商:Analog Devices 功能描述:DAC 1CH R-2R 16BIT 16SSOP - Tape and Reel

    

    
    
    
    
	
    	
    
    
     
     
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