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參數(shù)資料
| 型號(hào)： | AD669BRZ |
| 廠(chǎng)商： | Analog Devices Inc |
| 文件頁(yè)數(shù)： | 11/12頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC DAC 16BIT MONO W/VREF 28-SOIC |
| 產(chǎn)品培訓(xùn)模塊： | Data Converter Fundamentals DAC Architectures |
| 產(chǎn)品變化通告： | AD669 Improvement Change 11/Jul/2012 |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 系列： | DACPORT® |
| 設(shè)置時(shí)間： | 10µs |
| 位數(shù)： | 16 |
| 數(shù)據(jù)接口： | 并聯(lián) |
| 轉(zhuǎn)換器數(shù)目： | 1 |
| 電壓電源： | 雙 ± |
| 功率耗散（最大）： | 625mW |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類(lèi)型： | 表面貼裝 |
| 封裝/外殼： | 28-SOIC（0.295"，7.50mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 28-SOIC W |
| 包裝： | 管件 |
| 輸出數(shù)目和類(lèi)型： | 1 電壓，單極；1 電壓，雙極 |
| 采樣率（每秒）： | 167k |
| 產(chǎn)品目錄頁(yè)面： | 781 (CN2011-ZH PDF) |
AD669
REV. A
–8–
OUTPUT SETTLING AND GLITCH
The AD669’s output buffer amplifier typically settles to within
0.0008% FS (l/2 LSB) of its final value in 8
s for a full-scale
step. Figures 7a and 7b show settling for a full-scale and an LSB
step, respectively, with a 2 k
, 1000 pF load applied. The guar-
anteed maximum settling time at +25
°C for a full-scale step is
13
s with this load. The typical settling time for a 1 LSB step is
2.5
s.
The digital-to-analog glitch impulse is specified as 15 nV-s typi-
cal. Figure 7c shows the typical glitch impulse characteristic at
the code 011 . . . 111 to 100 . . . 000 transition when loading
the second rank register from the first rank register.
20
–10
0
+10
10
600
400
200
0
–200
–400
–600
VOLTS
s
V
a. –10 V to +10 V Full-Scale Step Settling
5
0
600
400
200
–200
–400
–600
s
V
1
23
4
b. LSB Step Settling
5
0
+10
–10
s
mV
1
23
4
c. D-to-A Glitch Impulse
Figure 7. Output Characteristics
DIGITAL CIRCUIT DETAILS
The bus interface logic of the AD669 consists of two indepen-
dently addressable registers in two ranks. The first rank consists
of a 16-bit register which is loaded directly from a 16-bit micro-
processor bus. Once the 16-bit data word has been loaded in the
first rank, it can be loaded into the 16-bit register of the second
rank. This double-buffered organization avoids the generation of
spurious analog output values.
The first rank latch is controlled by CS and L1. Both of these
inputs are active low and are level-triggered. This means that
data present during the time when both CS and L1 are low will
enter the latch. When either one of these signals returns high,
the data is latched.
The second rank latch is controlled by LDAC. This input is ac-
tive high and is also level-triggered. Data that is present when
LDAC is high will enter the latch, and hence the DAC will
change state. When this pin returns low, the data is latched in
the DAC.
Note that LDAC is not gated with CS or any other control sig-
nal. This makes it possible to simultaneously update all of the
AD669’s present in a multi-DAC system by tying the LDAC
pins together. After the first rank register of each DAC has been
individually loaded and latched, the second rank registers are
then brought high together, updating all of the DACs at the
between the first rank load and the second rank load.
The first rank latch and second rank latch can be used together
in a master-slave or edge-triggered configuration. This mode of
operation occurs when LDAC and CS are tied together with L1
tied to ground. Rising edges on the LDAC-CS pair will update
the DAC with the data presented preceding the edge. The tim-
ing diagram for operation in this mode can be seen in Figure lb.
Note, however, that the sum of tLOW and tHIGH must be long
enough to allow the DAC output to settle to its new value.
Table I. AD669 Truth Table
CS
L1
LDAC
Operation
0
X
First Rank Enable
X
1
X
First Rank Latched
1
X
First Rank Latched
X
1
Second Rank Enabled
X
0
Second Rank Latched
0
1
All Latches Transparent
“X” = Don’t Care
It is possible to make the second rank register transparent by ty-
ing Pin 23 high. Any data appearing in the first rank register will
then appear at the output of the DAC. It should be noted, how-
ever, that the deskewing provided by the second rank latch is
then defeated, and glitch impulse may increase. If it is desired to
make both registers transparent, this can be done by tying Pins
5 and 6 low and Pin 23 high. Table I shows the truth table for
the AD669, while the timing diagram is found in Figure 1.
INPUT CODING
The AD669 uses positive-true binary input coding. Logic “1” is
represented by an input voltage greater than 2.0 V, and Logic
“0” is defined as an input voltage less than 0.8 V.
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| AD669BRZ-REEL | 功能描述:IC DAC 16BIT MONO VREF 28-SOIC RoHS:是 類(lèi)別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:DACPORT® 產(chǎn)品培訓(xùn)模塊:Data Converter Fundamentals DAC Architectures 標(biāo)準(zhǔn)包裝:750 系列:- 設(shè)置時(shí)間:7µs 位數(shù):16 數(shù)據(jù)接口:并聯(lián) 轉(zhuǎn)換器數(shù)目:1 電壓電源:雙 ± 功率耗散（最大）:100mW 工作溫度:0°C ~ 70°C 安裝類(lèi)型:表面貼裝 封裝/外殼:28-LCC（J 形引線(xiàn)） 供應(yīng)商設(shè)備封裝:28-PLCC（11.51x11.51） 包裝:帶卷 (TR) 輸出數(shù)目和類(lèi)型:1 電壓，單極；1 電壓，雙極 采樣率（每秒）:143k |
| AD669SQ | 功能描述:數(shù)模轉(zhuǎn)換器- DAC IC MONO 16-BIT RoHS:否 制造商:Analog Devices 轉(zhuǎn)換器數(shù)量:4 DAC 輸出端數(shù)量:4 轉(zhuǎn)換速率: 分辨率:12 bit 接口類(lèi)型:Serial (I2C) 穩(wěn)定時(shí)間: 最大工作溫度:+ 105 C 安裝風(fēng)格: 封裝 / 箱體:TSSOP 封裝:Reel |
| AD669SQ/883B | 功能描述:數(shù)模轉(zhuǎn)換器- DAC IC MONO 16-BIT RoHS:否 制造商:Analog Devices 轉(zhuǎn)換器數(shù)量:4 DAC 輸出端數(shù)量:4 轉(zhuǎn)換速率: 分辨率:12 bit 接口類(lèi)型:Serial (I2C) 穩(wěn)定時(shí)間: 最大工作溫度:+ 105 C 安裝風(fēng)格: 封裝 / 箱體:TSSOP 封裝:Reel |
| AD66BS | 制造商:POP 功能描述: 制造商:RIVETS 功能描述: |
| AD67 | 制造商:MQP (ELECTRONICS) 功能描述:ADAPTOR DIL 28WAY 制造商:MQP (ELECTRONICS) 功能描述:ADAPTOR, DIL, 28WAY 制造商:MQP (ELECTRONICS) 功能描述:ADAPTOR, DIL, 28WAY; Connector Type:Adaptor; No. of Contacts:28; Row Pitch:0.6"; Contact Termination:Through Hole Vertical; SVHC:No SVHC (19-Dec-2012); Connector Mounting Orientation:PC Board; No. of Ways:28; Package / Case:DIL; Pin ;RoHS Compliant: Yes |
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