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參數(shù)資料
型號: AD734BNZ
廠商: Analog Devices Inc
文件頁數(shù): 16/20頁
文件大?。?/td> 0K
描述: IC MULT/DIV 4-QUADRANT 14-DIP
標準包裝: 1
功能: 模擬乘法器
位元/級數(shù): 四象限
封裝/外殼: 14-DIP(0.300",7.62mm)
供應商設備封裝: 14-PDIP
包裝: 管件
產品目錄頁面: 789 (CN2011-ZH PDF)
AD734
Rev. E | Page 5 of 20
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Rating
Supply Voltage
±18 V
Internal Power Dissipation
for TJ max = 175°C
500 mW
X, Y, and Z Input Voltages
VN to VP
Output Short-Circuit Duration
Indefinite
Storage Temperature Range
Q-14
65°C to +150°C
N-14
65°C to +150°C
Operating Temperature Range
AD734A, AD734B (Industrial)
40°C to +85°C
AD734S (Military)
55°C to +125°C
Lead Temperature Range (Soldering, 60 sec)
+300°C
Transistor Count
81
ESD Rating
500 V
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 3. Thermal Resistance
Package Type
θJA
Unit
14-Lead PDIP (N-14)
150
°C/W
14-Lead CERDIP (Q-14)
110
°C/W
ESD CAUTION
W
12
DD
13
VP
14
X2
2
3
U0
U1
U2
X1
1
Z2
ER
VN
Y2
Y1
Z1
11
10
9
8
7
6
5
4
0.122
(3.0988)
0.093 (2.3622)
0082
7-
00
2
Figure 2. Chip Dimensions and Bonding Diagram, Dimensions shown in inches and (mm), (Contact factory for latest dimensions)
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