TA = 25°C, unle" />
參數(shù)資料
型號: AD7478AARMZ-REEL
廠商: Analog Devices Inc
文件頁數(shù): 3/29頁
文件大?。?/td> 0K
描述: IC ADC 8BIT 1MSPS 8-MSOP
標準包裝: 3,000
位數(shù): 8
采樣率(每秒): 1M
數(shù)據(jù)接口: DSP,MICROWIRE?,QSPI?,串行,SPI?
轉(zhuǎn)換器數(shù)目: 1
功率耗散(最大): 17.5mW
電壓電源: 單電源
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 8-TSSOP,8-MSOP(0.118",3.00mm 寬)
供應商設備封裝: 8-MSOP
包裝: 帶卷 (TR)
輸入數(shù)目和類型: 1 個單端,單極
AD7476A/AD7477A/AD7478A
Rev. F | Page 10 of 28
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.1
Table 5.
Parameter
Ratings
VDD to GND
–0.3 V to +7 V
Analog Input Voltage to GND
–0.3 V to VDD + 0.3 V
Digital Input Voltage to GND
–0.3 V to +7 V
Digital Output Voltage to GND
–0.3 V to VDD + 0.3 V
Input Current to Any Pin Except Supplies
10 mA
Operating Temperature Range
Commercial (A and B Grades)
–40°C to +85°C
Industrial (Y Grade)
–40°C to +125°C
Storage Temperature Range
–65°C to +150°C
Junction Temperature
150
°C
MSOP Package
θJA Thermal Impedance
205.9°C/W
θJC Thermal Impedance
43.74°C/W
SC70 Package
θJA Thermal Impedance
340.2°C/W
θJC Thermal Impedance
228.9°C/W
Lead Temperature, Soldering
Reflow (10 sec to 30 sec)
235 (0/+5)°C
Pb-Free Temperature Soldering
Reflow
255 (0/+5)°C
ESD
3.5 kV
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
1
Transient currents of up to 100 mA do not cause SCR latch-up.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
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