AD7537
REV.
–3–
TIMING CHARACTERISTICS
Limit at
TA = –40 CTA = +55 C
Parameter
TA = +25 C
to +85 C
to +125 C
Units
Test Conditions/Comments
t1
15
30
ns min
Address Valid to Write Setup Time
t2
15
25
ns min
Address Valid to Write Hold Time
t3
60
80
ns min
Data Setup Time
t4
25
ns min
Data Hold Time
t5
0
ns min
Chip Select or Update to Write Setup Time
t6
0
ns min
Chip Select or Update to Write Hold Time
t7
80
100
ns min
Write Pulse Width
t8
80
100
ns min
Clear Pulse Width
Specifications subject to change without notice.
ABSOLUTE MAXIMUM RATINGS*
(TA = +25
°C unless otherwise stated)
VDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +17 V
VREFA, VREFB to AGNDA, AGNDB . . . . . . . . . . . . . . . .
±25 V
VRFBA, VRFBB to AGNDA, AGNDB . . . . . . . . . . . . . . . .
±25 V
Digital Input Voltage to DGND . . . . . . . –0.3 V, VDD +0.3 V
IOUTA, IOUTB to DGND . . . . . . . . . . . . . . –0.3 V, VDD +0.3 V
AGNDA, AGNDB to DGND . . . . . . . . . –0.3 V, VDD +0.3 V
Power Dissipation (Any Package)
To +75
°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 450 mW
Derates Above +75
°C . . . . . . . . . . . . . . . . . . . . . 6 mW/°C
Operating Temperature Range
Commercial Plastic (J, K, L Versions) . . . . –40
°C to +85°C
Industrial Hermetic (A, B, C Versions) . . . –40
°C to +85°C
Extended Hermetic (S, T, U Versions) . . –55
°C to +125°C
Storage Temperature . . . . . . . . . . . . . . . . –65
°C to +150°C
Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . . +300
°C
*Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those indicated in
the operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
WARNING!
ESD SENSITIVE DEVICE
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD7537 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
Figure 1. Timing Diagram
(VDD = +10.8 V to +16.5 V, VREFA = VREFB = +10 V; IOUTA = AGNDA = 0 V, IOUTB = AGNDB = 0 V.)
A