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參數(shù)資料
型號: AD7808BRZ
廠商: Analog Devices Inc
文件頁數(shù): 25/28頁
文件大?。?/td> 0K
描述: IC DAC 10BIT OCTAL SRL 24-SOIC
產(chǎn)品培訓(xùn)模塊: Data Converter Fundamentals
DAC Architectures
標(biāo)準(zhǔn)包裝: 31
設(shè)置時間: 1.5µs
位數(shù): 10
數(shù)據(jù)接口: 串行
轉(zhuǎn)換器數(shù)目: 4
電壓電源: 模擬和數(shù)字
功率耗散(最大): 99mW
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 24-SOIC(0.295",7.50mm 寬)
供應(yīng)商設(shè)備封裝: 24-SOIC W
包裝: 管件
輸出數(shù)目和類型: 8 電壓,雙極
采樣率(每秒): 667k
產(chǎn)品目錄頁面: 785 (CN2011-ZH PDF)
AD7804/AD7805/AD7808/AD7809
REV. A
–6–
PDIP (N-24) Package, Power Dissipation . . . . . . . . . 670 mW
θ
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 105
°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260
°C
SOIC (R-28) Package, Power Dissipation . . . . . . . . . 875 mW
θ
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 70
°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220
°C
PDIP (N-28) Package, Power Dissipation . . . . . . . . . 875 mW
θ
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 75
°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260
°C
SSOP (RS-28) Package, Power Dissipation . . . . . . . . 875 mW
θ
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 110
°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220
°C
TQFP (S
U-44) Package, Power Dissipation . . . . . .
450 mW
θ
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 116
°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220
°C
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2The outputs may be shorted to voltages in this range provided the power dissipation
of the package is not exceeded.
3Transient currents of up to 100 mA will not cause SCR latch-up.
ABSOLUTE MAXIMUM RATINGS
1
(TA = +25°C unless otherwise noted)
DVDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
AVDD to AGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
AGND to DGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V + 0.3 V
Digital Input Voltage to DGND . . . . . –0.3 V to DVDD + 0.3 V
Analog Input Voltage to AGND . . . . . –0.3 V to AVDD + 0.3 V
COMP to AGND . . . . . . . . . . . . . . . –0.3 V to AVDD + 0.3 V
REF OUT to AGND . . . . . . . . . . . . . . . . . . –0.3 V to + AVDD
REF IN to AGND . . . . . . . . . . . . . . . –0.3 V to AVDD + 0.3 V
VOUT to AGND
2
. . . . . . . . . . . . . . . . –0.3 V to AVDD + 0.3 V
Input Current to Any Pin Except Supplies
3
. . . . . . . .
±10 mA
Operating Temperature Range
AD7804/AD7805 Commercial Plastic
(B, C Versions) . . . . . . . . . . . . . . . . . . . . –40
°C to +85°C
AD7808/AD7809 Commercial Plastic
(B, C Versions) . . . . . . . . . . . . . . . . . . . . –40
°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65
°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150
°C
SOIC (R-16) Package, Power Dissipation . . . . . . . . . 450 mW
θ
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 75
°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220
°C
PDIP (N-16) Package, Power Dissipation . . . . . . . . . 670 mW
θ
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 116
°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260
°C
SOIC (R-24) Package, Power Dissipation . . . . . . . . . 450 mW
θ
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 75
°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220
°C
ORDERING GUIDE
Supply
Temperature
Relative
Package
Model
Voltage
Range
Accuracy
Package Descriptions
Options
AD7804BN
3.3 V to 5 V
–40
°C to +85°C
±3 LSB
16-Lead Plastic DIP
N-16
AD7804BR
3.3 V to 5 V
–40
°C to +85°C
±3 LSB
16-Lead Small Outline IC
R-16
AD7805BN
3.3 V to 5 V
–40
°C to +85°C
±3 LSB
28-Lead Plastic DIP
N-28
AD7805BR
3.3 V to 5 V
–40
°C to +85°C
±3 LSB
28 Lead Small Outline IC
R-28
AD7805BRS
3.3 V to 5 V
–40
°C to +85°C
±3 LSB
28-Lead Shrink Small Outline Package
RS-28
AD7805CR
3.3 V to 5 V
–40
°C to +85°C
±3 LSB
28-Lead Small Outline IC
R-28
AD7808BN
3.3 V to 5 V
–40
°C to +85°C
±4 LSB
24-Lead Plastic DIP
N-24
AD7808BR
3.3 V to 5 V
–40
°C to +85°C
±4 LSB
24 Lead Small Outline IC
R-24
AD7809BST
3.3 V to 5 V
–40
°C to +85°C
±4 LSB
44-Lead Thin Plastic Quad Flatpack (TQFP)
S
U-44
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although these devices feature proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
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