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參數(shù)資料
| 型號(hào)： | AD7813YRU |
| 廠商： | ANALOG DEVICES INC |
| 元件分類： | ADC |
| 英文描述： | +2.7 V to +5.5 V, 400 kSPS 8-/10-Bit Sampling ADC |
| 中文描述： | 1-CH 10-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, PDSO16 |
| 封裝： | TSSOP-16 |
| 文件頁數(shù)： | 3/11頁 |
| 文件大小： | 185K |
| 代理商： | AD7813YRU |
AD7813
–3–
REV. B
ORDERING GUIDE
Linearity
Error
(LSB)
Package
Description
Package
Option
Model
AD7813YN
AD7813YR
AD7813YRU
±
1 LSB
±
1 LSB
±
1 LSB
Plastic DIP
Small Outline IC
Thin Shrink Small Outline RU-16
(TSSOP)
N-16
R-16A
TIMING CHARACTERISTICS
1, 2
Parameter
V
DD
= 3 V
10%
V
DD
= 5 V 10%
Unit
Conditions/Comments
t
POWER-UP
t
1
t
2
t
3
t
4
t
5
t
63
t
73, 4
1
2.3
20
30
0
0
10
10
5
10
50
1
2.3
20
30
0
0
10
10
5
10
50
μ
s (max)
μ
s (max)
ns (min)
ns (max)
ns (min)
ns (min)
ns (max)
ns (max)
ns (min)
ns (min)
ns (min)
Power-Up Time of AD7813 after Rising Edge of
CONVST
.
Conversion Time.
CONVST
Pulsewidth.
CONVST
Falling Edge to BUSY Rising Edge Delay.
CS
to
RD
Setup Time.
CS
Hold Time after
RD
High.
Data Access Time after
RD
Low.
Bus Relinquish Time after
RD
High.
t
8
t
93
Minimum Time Between MSB and LSB Reads.
Rising Edge of
CS
or
RD
to Falling Edge of
CONVST
Delay.
NOTES
1
Sample tested to ensure compliance.
2
See Figures 12, 13 and 14.
3
These numbers are measured with the load circuit of Figure 1. They are defined as the time required for the o/p to cross 0.8 V or 2.4 V for V
DD
= 5 V
±
10% and
0.4 V or 2 V for V
= 3 V
±
10%.
4
Derived from the measured time taken by the data outputs to change 0.5 V when loaded with the circuit of Figure 1. The measured number is then extrapolated back
to remove the effects of charging or discharging the 50 pF capacitor. This means that the time, t
7
, quoted in the Timing Characteristics is the true bus relinquish time
of the part and as such is independent of external bus loading capacitances.
(–40 C to +105 C, unless otherwise noted)
ABSOLUTE MAXIMUM RATINGS*
V
DD
to DGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Digital Input Voltage to DGND
(
CONVST
,
RD
,
CS
) . . . . . . . . . . . . . . –0.3 V, V
DD
+ 0.3 V
Digital Output Voltage to DGND
(BUSY, DB0–DB7) . . . . . . . . . . . . . . . –0.3 V, V
DD
+ 0.3 V
REF
IN
to AGND . . . . . . . . . . . . . . . . . . . –0.3 V, V
DD
+ 0.3 V
Analog Input . . . . . . . . . . . . . . . . . . . . . . –0.3 V, V
DD
+ 0.3 V
Storage Temperature Range . . . . . . . . . . . . –65
°
C to +150
°
C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . .+150
°
C
Plastic DIP Package, Power Dissipation . . . . . . . . . . 450 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . +105
°
C/W
Lead Temperature, (Soldering 10 sec) . . . . . . . . . . .+260
°
C
SOIC Package, Power Dissipation . . . . . . . . . . . . . . . 450 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 75
°
C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . .+215
°
C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . .+220
°
C
SSOP Package, Power Dissipation . . . . . . . . . . . . . . . 450 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . 115
°
C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . .+215
°
C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . .+220
°
C
ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
≥
4 kV
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute maximum rating condi-
tions for extended periods may affect device reliability.
+1.6V
200 A
I
OL
200 A
I
OH
C
L
50pF
TO
OUTPUT
PIN
Figure 1. Load Circuit for Digital Output Timing
Specifications
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| AD7813YN | +2.7 V to +5.5 V, 400 kSPS 8-/10-Bit Sampling ADC |
| AD7813YR | +2.7 V to +5.5 V, 400 kSPS 8-/10-Bit Sampling ADC |
| AD7816AR-REEL | Low Cost, High Speed Rail-to-Rail Amplifier (Single); Package: SOIC; No of Pins: 8; Temperature Range: TBD |
| AD7818AR-REEL | 3/5V, 1 MSPS, 8-Bit, Serial Interface Sampling ADC; Package: SOIC; No of Pins: 8; Temperature Range: Commercial |
| AD7816-7818 | Single- and 4-Channel, 9 us, 10-Bit ADCs with On-Chip Temperature Sensor |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AD7813YRU-REEL | 制造商:Analog Devices 功能描述:ADC Single SAR 400ksps 10-bit Parallel 16-Pin TSSOP T/R 制造商:Analog Devices 功能描述:ADC SGL SAR 400KSPS 10-BIT PARALLEL 16TSSOP - Tape and Reel |
| AD7813YRU-REEL7 | 制造商:Analog Devices 功能描述:ADC Single SAR 400ksps 10-bit Parallel 16-Pin TSSOP T/R |
| AD7813YRUZ | 功能描述:IC ADC 10BIT PARALLEL 16TSSOP RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 模數(shù)轉(zhuǎn)換器 系列:- 標(biāo)準(zhǔn)包裝:1,000 系列:- 位數(shù):16 采樣率（每秒）:45k 數(shù)據(jù)接口:串行 轉(zhuǎn)換器數(shù)目:2 功率耗散（最大）:315mW 電壓電源:模擬和數(shù)字 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:28-SOIC（0.295"，7.50mm 寬） 供應(yīng)商設(shè)備封裝:28-SOIC W 包裝:帶卷 (TR) 輸入數(shù)目和類型:2 個(gè)單端，單極 |
| AD7813YRUZ-REEL | 制造商:Analog Devices 功能描述:ADC Single SAR 400ksps 10-bit Parallel 16-Pin TSSOP T/R 制造商:Analog Devices 功能描述:ADC SGL SAR 400KSPS 10-BIT PARALLEL 16TSSOP - Tape and Reel |
| AD7813YRUZ-REEL7 | 功能描述:IC ADC 10BIT PARALLEL 16TSSOP RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 模數(shù)轉(zhuǎn)換器 系列:- 標(biāo)準(zhǔn)包裝:2,500 系列:- 位數(shù):16 采樣率（每秒）:15 數(shù)據(jù)接口:MICROWIRE?，串行，SPI? 轉(zhuǎn)換器數(shù)目:1 功率耗散（最大）:480µW 電壓電源:單電源 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:38-WFQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:38-QFN（5x7） 包裝:帶卷 (TR) 輸入數(shù)目和類型:16 個(gè)單端，雙極；8 個(gè)差分，雙極 配用:DC1011A-C-ND - BOARD DELTA SIGMA ADC LTC2494 |
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