參數(shù)資料
型號： AD7879-1WARUZ-RL
廠商： Analog Devices Inc
文件頁數(shù)： 32/41頁
文件大小： 0K
描述： IC ADC 12BIT CTRLR TOUCH 16TSSOP
標(biāo)準(zhǔn)包裝： 2,500
類型： 電阻
觸摸面板接口： 4 線
輸入數(shù)/鍵： 1 TSC
分辨率（位）： 12 b
評估套件： *
數(shù)據(jù)接口： I²C，串行
數(shù)據(jù)速率/采樣率 (SPS，BPS)： 105k
電壓基準(zhǔn)： 內(nèi)部
電源電壓： 1.6 V ~ 3.6 V
工作溫度： -40°C ~ 85°C
安裝類型： 表面貼裝
封裝/外殼： 16-TSSOP（0.173"，4.40mm 寬）
供應(yīng)商設(shè)備封裝： 16-TSSOP
包裝： 帶卷 (TR)
AD7879/AD7889
Rev. C | Page 37 of 40
GROUNDING AND LAYOUT
For detailed information on grounding and layout considerations
for the AD7879/AD7889, refer to the AN-577 Application Note,
Layout and Grounding Recommendations for Touch Screen
Digitizers.
LEAD FRAME CHIP SCALE PACKAGES
The lands on the lead frame chip scale package (CP-16-10) are
rectangular. The printed circuit board (PCB) pad for these lands
should be 0.1 mm longer than the package land length and
0.05 mm wider than the package land width. Center the land on
the pad to maximize the solder joint size.
The bottom of the lead frame chip scale package has a central
thermal pad. The thermal pad on the PCB should be at least as
large as this exposed pad. To avoid shorting, provide a clearance
of at least 0.25 mm between the thermal pad and the inner
edges of the land pattern on the PCB. Thermal vias can be used
on the PCB thermal pad to improve the thermal performance of
the package. If vias are used, incorporate them into the thermal
pad at a 1.2 mm pitch grid. The via diameter should be between
0.3 mm and 0.33 mm, and the via barrel should be plated with
1 oz. of copper to plug the via.
Connect the PCB thermal pad to GND.
WLCSP ASSEMBLY CONSIDERATIONS
For detailed information on the WLCSP PCB assembly and
reliability, see the AN-617 Application Note, MicroCSP Wafer
Level Chip Scale Package.
NC = NO CONNECT
1
Y+
2
NC
3
NC
4
X–
11
NC
12
10
NC
9
DOUT
5
6
7
8
15
16
14
13
07667-
045
AD7879/
AD7889
PENIRQ/INT/DAV
Y–
DI
N
G
ND
SCL
V
CC
/RE
F
X+
AUX
/
VBA
T/
GP
IO
CS
TOUCH
SCREEN
0.1F
0.1F TO 10F
(OPTIONAL)
VOLTAGE
REGULATOR
MAIN
BATTERY
INT
SCLK
MISO
MOSI
SPI
IN
TE
R
F
ACE
HOST
CS
Figure 46. Typical Application Circuit
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PDF描述
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AD7879-1WARUZ-RL7 功能描述:IC ADC 12BIT CTRLR TOUCH 16TSSOP RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 觸摸屏控制器 系列:- 標(biāo)準(zhǔn)包裝:96 系列:- 類型:- 觸摸面板接口:- 輸入數(shù)/鍵:- 分辨率（位）:- 評估套件:* 數(shù)據(jù)接口:- 數(shù)據(jù)速率/采樣率 (SPS，BPS):- 電壓基準(zhǔn):- 電源電壓:- 電流 - 電源:- 工作溫度:- 安裝類型:表面貼裝 封裝/外殼:16-TSSOP（0.173"，4.40mm 寬） 供應(yīng)商設(shè)備封裝:16-TSSOP 包裝:帶卷 (TR)
AD7879ACBZ-500R7 制造商:AD 制造商全稱:Analog Devices 功能描述:Low Voltage Controller for Touch Screens
AD7879ACBZ-RL 制造商:Analog Devices 功能描述:
AD7879ACPZ-500R7 制造商:Analog Devices 功能描述:TOUCH SCREEN CONTROLLER - Tape and Reel 制造商:Analog Devices 功能描述:ADC 12BIT 3.6V 105KSPS SPI 16LFCSP 制造商:Analog Devices 功能描述:ADC, 12BIT, 3.6V, 105KSPS, SPI, 16LFCSP 制造商:Analog Devices 功能描述:ADC, 12BIT, 3.6V, 105KSPS, SPI, 16LFCSP; Resolution (Bits):12bit; Sampling Rate:105kSPS; Digital IC Case Style:LFCSP; No. of Pins:16; Input Channel Type:Single Ended; Data Interface:SPI; Operating Temperature Min:-40C; Operating ;RoHS Compliant: Yes
AD7879ACPZ-RL 功能描述:IC ADC 12BIT CTLR TOUCH 16LFCSP RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 觸摸屏控制器 系列:- 標(biāo)準(zhǔn)包裝:96 系列:- 類型:- 觸摸面板接口:- 輸入數(shù)/鍵:- 分辨率（位）:- 評估套件:* 數(shù)據(jù)接口:- 數(shù)據(jù)速率/采樣率 (SPS，BPS):- 電壓基準(zhǔn):- 電源電壓:- 電流 - 電源:- 工作溫度:- 安裝類型:表面貼裝 封裝/外殼:16-TSSOP（0.173"，4.40mm 寬） 供應(yīng)商設(shè)備封裝:16-TSSOP 包裝:帶卷 (TR)
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