AD7887
Rev. D | Page 6 of 24
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Parameter
Rating
VDD to AGND
0.3 V to +7 V
Analog Input Voltage to AGND
0.3 V to VDD + 0.3 V
Digital Input Voltage to AGND
0.3 V to VDD + 0.3 V
Digital Output Voltage to AGND
0.3 V to VDD + 0.3 V
REFIN/REFOUT to AGND
0.3 V to VDD + 0.3 V
±10 mA
Operating Temperature Range
Commercial Temperature Range
A, B Versions
40°C to +125°C
Storage Temperature Range
65°C to +150°C
Junction Temperature
+150°C
SOIC or MSOP Package Power Dissipation
450 mW
θJA Thermal Impedance
157°C/W (SOIC)
205.9°C/W (MSOP)
θJC Thermal Impedance
56°C/W (SOIC)
43.74°C/W (MSOP)
Lead Temperature, Soldering
Vapor Phase (60 sec)
215°C
Infrared (15 sec)
220°C
Pb-Free Temperature, Soldering Reflow
260(0)°C
ESD
4 kV
1 Transient currents of up to 100 mA do not cause SCR latch-up.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION