- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄5445 > AD8038AKSZ-REEL (Analog Devices Inc)IC OPAMP VF LP LN LDIST SC70-5 PDF資料下載
參數(shù)資料
| 型號(hào)： | AD8038AKSZ-REEL |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 14/17頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC OPAMP VF LP LN LDIST SC70-5 |
| 設(shè)計(jì)資源： | AC Signal Processing Using AD5426/32/43 Current Output DACs (CN0037) AC Signal Processing Using AD5450/1/2/3 Current Output DACs (CN0054) |
| 標(biāo)準(zhǔn)包裝： | 10,000 |
| 放大器類型： | 電壓反饋 |
| 電路數(shù)： | 1 |
| 轉(zhuǎn)換速率： | 425 V/µs |
| -3db帶寬： | 350MHz |
| 電流 - 輸入偏壓： | 400pA |
| 電壓 - 輸入偏移： | 500µV |
| 電流 - 電源： | 1mA |
| 電壓 - 電源，單路/雙路(±)： | 3 V ~ 12 V，±1.5 V ~ 6 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 6-TSSOP（5 引線），SC-88A，SOT-353 |
| 供應(yīng)商設(shè)備封裝： | SC-70-5 |
| 包裝： | 帶卷 (TR) |
AD8038/AD8039
Rev. G | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Rating
Supply Voltage
12.6 V
Power Dissipation
See Figure 5
Common-Mode Input Voltage
±VS
Differential Input Voltage
±4 V
Storage Temperature Range
65°C to +125°C
Operating Temperature Range
40°C to +85°C
Lead Temperature (Soldering, 10 sec)
300°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation in the AD8038/AD8039
package is limited by the associated rise in junction temperature
(TJ) on the die. The plastic encapsulating the die locally reaches
the junction temperature. At approximately 150°C, which is the
glass transition temperature, the plastic changes its properties.
Even temporarily exceeding this temperature limit may change
the stresses that the package exerts on the die, permanently
shifting the parametric performance of the AD8038/AD8039.
Exceeding a junction temperature of 175°C for an extended
time can result in changes in the silicon devices, potentially
causing failure.
The still-air thermal properties of the package and PCB (θJA),
ambient temperature (TA), and total power dissipated in the
package (PD) determine the junction temperature of the die.
The junction temperature can be calculated as
TJ = TA + (PD × θJA)
The power dissipated in the package (PD) is the sum of the
quiescent power dissipation and the power dissipated in the
package due to the load drive for all outputs. The quiescent power
is the voltage between the supply pins (VS) multiplied by the
quiescent current (IS). Assuming the load (RL) is referenced to
midsupply, then the total drive power is VS/2 × IOUT, some of which
is dissipated in the package and some in the load (VOUT × IOUT).
The difference between the total drive power and the load
power is the drive power dissipated in the package.
PD = quiescent power + (total drive power load power)
PD = [VS × IS] + [(VS/2) × (VOUT/RL)] [VOUT2/RL]
AMBIENT TEMPERATURE (°C)
0
–55
MA
XI
MU
M
P
O
W
E
R
D
IS
S
IPA
T
IO
N
(W
)
1.0
–25
5
35
65
95
125
1.5
2.0
SOIC-8
0.5
SC70-5
SOT-23-8
02
95
1-
00
5
Figure 5. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
RMS output voltages should be considered. If RL is referenced to
VS, as in single-supply operation, then the total drive power is
VS × IOUT. If the rms signal levels are indeterminate, consider the
worst case, when VOUT = VS /4 for RL to midsupply
PD = (VS × IS) + (VS/4)2/RL
In single-supply operation with RL referenced to VS, worst case
is VOUT = VS /2.
Airflow increases heat dissipation, effectively reducing θJA. In
addition, more metal directly in contact with the package leads
from metal traces, throughholes, ground, and power planes reduce
the θJA. Care must be taken to minimize parasitic capacitances at
the input leads of high speed op amps as discussed in the
Figure 5 shows the maximum safe power dissipation in the
package vs. the ambient temperature for the 8-lead SOIC
(125°C/W), 5-lead SC70 (210°C/W), and 8-lead SOT-23
(160°C/W) packages on a JEDEC standard 4-layer board.
θJA values are approximations.
OUTPUT SHORT CIRCUIT
Shorting the output to ground or drawing excessive current
from the AD8038/AD8039 will likely cause a catastrophic failure.
ESD CAUTION
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 51750-046LF | PWRBLADE VERT LF RECEPT |
| AD8604DRUZ-REEL | IC OPAMP QUAD R-R I/O 14TSSOP |
| ADTL084ARZ-REEL | IC OPAMP JFET 5MHZ QUAD 14SOIC |
| HM1S42FER000H6LF | METRAL RCT STR PF 4X12 |
| 8-34148-1 | CONN RING 16-22 AWG #8 P-G |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AD8038AKSZ-REEL7 | 功能描述:IC OPAMP VF LP LN LDIST SC70-5 RoHS:是 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 產(chǎn)品培訓(xùn)模塊:Differential Circuit Design Techniques for Communication Applications 標(biāo)準(zhǔn)包裝:1 系列:- 放大器類型:RF/IF 差分 電路數(shù):1 輸出類型:差分 轉(zhuǎn)換速率:9800 V/µs 增益帶寬積:- -3db帶寬:2.9GHz 電流 - 輸入偏壓:3µA 電壓 - 輸入偏移:- 電流 - 電源:40mA 電流 - 輸出 / 通道:- 電壓 - 電源，單路/雙路(±):3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:16-VQFN 裸露焊盤，CSP 供應(yīng)商設(shè)備封裝:16-LFCSP-VQ 包裝:剪切帶 (CT) 產(chǎn)品目錄頁面:551 (CN2011-ZH PDF) 其它名稱:ADL5561ACPZ-R7CT |
| AD8038AKSZ-REEL7 | 制造商:Analog Devices 功能描述:IC OP-AMP 350MHZ 425V/S SC-70-5 |
| AD8038AR | 制造商:Analog Devices 功能描述:OP Amp Single Volt Fdbk 制造商:Rochester Electronics LLC 功能描述:SOIC, SINGLE LOW-PWR VLTG-FDBK OP AMP - Bulk 制造商:Analog Devices 功能描述:IC OP-AMP LOW POWER VF |
| AD8038AR-EBZ | 功能描述:BOARD EVAL FOR AD8038AR RoHS:是 類別:編程器，開發(fā)系統(tǒng) >> 評(píng)估板 - 運(yùn)算放大器 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:1 系列:- |
| AD8038AR-REEL | 制造商:Analog Devices 功能描述:OP Amp Single Volt Fdbk ±6V/12V 8-Pin SOIC N T/R |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。