參數(shù)資料
型號(hào): AD8223BRZ-R7
廠商: Analog Devices Inc
文件頁(yè)數(shù): 18/20頁(yè)
文件大?。?/td> 0K
描述: IC AMP INST R-R LP 8SOIC
標(biāo)準(zhǔn)包裝: 1,000
放大器類型: 儀表
電路數(shù): 1
輸出類型: 滿擺幅
轉(zhuǎn)換速率: 0.3 V/µs
-3db帶寬: 200kHz
電流 - 輸入偏壓: 12nA
電壓 - 輸入偏移: 100µV
電流 - 電源: 650µA
電壓 - 電源,單路/雙路(±): 3 V ~ 24 V,±2 V ~ 12 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 8-SOIC(0.154",3.90mm 寬)
供應(yīng)商設(shè)備封裝: 8-SO
包裝: 帶卷 (TR)
AD8223
Rev. 0 | Page 7 of 20
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
Rating
Supply Voltage
±12 V
Internal Power Dissipation
650 mW
Differential Input Voltage
±VS
Output Short-Circuit Duration
Indefinite
Storage Temperature Range (R, RM)
65°C to +125°C
Operating Temperature Range
40°C to +85°C
Lead Temperature (Soldering, 10 sec)
300°C
ESD (Human Body Model)
1.5 kV
ESD (Charge Device Model)
500 V
ESD (Machine Model)
100 V
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Specification is for the device in free air.
Table 5. Thermal Resistance
Package Type
θJA
Unit
8-Lead SOIC (R)
155
°C/W
8-Lead MSOP (RM)
200
°C/W
ESD CAUTION
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