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Data Sheet
AD8324
Rev. B | Page 7 of 16
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
Figure 5. 20-Lead LFCSP Pin Configuration
Figure 6. 20-Lead QSOP Pin Configuration
Table 6. Pin Function Descriptions
Pin No.
20-Lead
LFCSP
20-Lead
QSOP
Mnemonic
Description
1, 2, 5, 9,
18, 19
1, 3, 4, 7,
11, 20
GND
Common External Ground Reference.
3
5
VIN+
Noninverting Input. DC-biased to approximately VCC/2. Must be ac-coupled with a 0.1 μF capacitor.
4
6
VIN–
Inverting Input. DC-biased to approximately VCC/2. Must be ac-coupled with a 0.1 μF capacitor.
6
8
DATEN
Data Enable Low Input. This port controls the 8-bit parallel data latch and shift register. A Logic 0
to Logic 1 transition transfers the latched data to the attenuator core (updates the gain) and
simultaneously inhibits serial data transfer into the register. A Logic 1 to Logic 0 transition inhibits
the data latch (holds the previous and simultaneously enables the register for serial data load).
7
9
SDATA
Serial Data Input. This digital input allows an 8-bit serial (gain) word to be loaded into the internal
register with the most significant bit (MSB) first.
8
10
CLK
Clock Input. The clock port controls the serial attenuator data transfer rate to the 8-bit master-
slave shift register. Logic 0 to Logic 1 transition latches the data bit, and a Logic 1 to Logic 0
transfers the data bit to the slave. This requires the input serial data-word to be valid at or before
this clock transition.
10
12
SLEEP
Low Power Sleep Mode. In sleep mode, the supply current of th
e AD8324 is reduced to 30 μA. A
Logic 0 powers down the part (high ZOUT state), and a Logic 1 powers up the part.
11
13
NC
No Connect. Do not connect to this pin.
12
14
BYP
Internal Bypass. This pin must be externally decoupled (0.1 μF capacitor).
13
15
VOUT–
14
16
VOUT+
15
17
RAMP
External RAMP Capacitor (Optional).
16
18
TXEN
Transmit Enable. Logic 0 disables forward transmission, and Logic 1 enables forward transmission.
17, 20
2, 19
VCC
Common Positive External Supply Voltage.
0
Not
applicable
EPAD
Exposed Pad. The exposed pad must be connected to a solid copper plane with low thermal
resistance. This applies to the 20-lead LFCSP package only.
TOP VIEW
(Not to Scale)
AD8324
1
2
3
4
5
15
14
13
12
11
16
17
20 19 18
67
8
9
10
GND
NOTES
1. NC = NO CONNECT. DO NOT CONNECT TO THIS PIN.
2. THE EXPOSED PAD MUST BE CONNECTED TO A SOLID COPPER PLANE
WITH A LOW THERMAL RESISTANCE. THIS APPLIES TO THE 20-LEAD
LFCSP PACKAGE ONLY.
VIN+
VIN–
GN
D
GN
D
V
CC
V
CC
TX
EN
GN
D
SL
E
EP
DA
T
E
N
SDA
T
A
CL
K
RAMP
VOUT+
VOUT–
BYP
NC
0
433
9-
0
-00
6
TOP VIEW
(Not to Scale)
20
19
18
17
16
15
14
13
12
11
1
2
3
4
5
6
7
8
9
10
AD8324
TXEN
SDATA
VCC
CLK
VIN+
SLEEP
BYP
NC
VOUT+
NC = NO CONNECT
GND
VIN–
GND
RAMP
VOUT–
GND
VCC
DATEN
04339-0-005