參數(shù)資料
型號: AD8331ARQ-REEL
廠商: Analog Devices Inc
文件頁數(shù): 51/56頁
文件大?。?/td> 0K
描述: IC VGA SINGLE W/PREAMP 20-SSOP
產(chǎn)品變化通告: Product Discontinuance 27/Oct/2011
設計資源: Interfacing the High Frequency AD8331 to AD9215 (CN0096)
標準包裝: 2,500
系列: X-AMP®
類型: 可變增益放大器
應用: 信號處理
安裝類型: 表面貼裝
封裝/外殼: 20-SSOP(0.154",3.90mm 寬)
供應商設備封裝: 20-QSOP
包裝: 帶卷 (TR)
配用: AD8331-EVALZ-ND - BOARD EVAL FOR AD8331
AD8331/AD8332/AD8334
Rev. G | Page 55 of 56
ORDERING GUIDE
Model1
Temperature Range
Package Description
Package Option
AD8331ARQ
–40°C to +85°C
20-Lead Shrink Small Outline Package (QSOP)
RQ-20
AD8331ARQ-REEL
–40°C to +85°C
20-Lead Shrink Small Outline Package (QSOP)
RQ-20
AD8331ARQ-REEL7
–40°C to +85°C
20-Lead Shrink Small Outline Package (QSOP)
RQ-20
AD8331ARQZ
–40°C to +85°C
20-Lead Shrink Small Outline Package (QSOP)
RQ-20
AD8331ARQZ-RL
–40°C to +85°C
20-Lead Shrink Small Outline Package (QSOP)
RQ-20
AD8331ARQZ-R7
–40°C to +85°C
20-Lead Shrink Small Outline Package (QSOP)
RQ-20
AD8331-EVALZ
Evaluation Board with AD8331ARQ
AD8332ACP-R2
–40°C to +85°C
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
CP-32-2
AD8332ACP-REEL
–40°C to +85°C
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
CP-32-2
AD8332ACP-REEL7
–40°C to +85°C
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
CP-32-2
AD8332ACPZ-R2
–40°C to +85°C
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
CP-32-2
AD8332ACPZ-R7
–40°C to +85°C
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
CP-32-2
AD8332ACPZ-RL
–40°C to +85°C
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
CP-32-2
AD8332ARU
–40°C to +85°C
28-Lead Thin Shrink Small Outline Package (TSSOP)
RU-28
AD8332ARU-REEL
–40°C to +85°C
28-Lead Thin Shrink Small Outline Package (TSSOP)
RU-28
AD8332ARU-REEL7
–40°C to +85°C
28-Lead Thin Shrink Small Outline Package (TSSOP)
RU-28
AD8332ARUZ
–40°C to +85°C
28-Lead Thin Shrink Small Outline Package (TSSOP)
RU-28
AD8332ARUZ-R7
–40°C to +85°C
28-Lead Thin Shrink Small Outline Package (TSSOP)
RU-28
AD8332ARUZ-RL
–40°C to +85°C
28-Lead Thin Shrink Small Outline Package (TSSOP)
RU-28
AD8332-EVALZ
Evaluation Board with AD8332ARU
AD8334ACPZ
–40°C to +85°C
64-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
CP-64-1
AD8334ACPZ-REEL
–40°C to +85°C
64-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
CP-64-1
AD8334ACPZ-REEL7
–40°C to +85°C
64-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
CP-64-1
AD8334-EVALZ
Evaluation Board with AD8334ACP
1 Z = RoHS Compliant Part.
相關PDF資料
PDF描述
AD8331ARQ IC VGA SINGLE W/PREAMP 20-QSOP
MAX951EUA+T IC OP AMP SS LP 8-UMAX
LTC1458LISW IC D/A CONV 12BIT R-R QUAD28SOIC
AD7249BRZ-REEL IC DAC 12BIT SRL W/REF 16SOIC
VI-B3T-MY-B1 CONVERTER MOD DC/DC 6.5V 50W
相關代理商/技術參數(shù)
參數(shù)描述
AD8331ARQ-REEL7 功能描述:IC VGA SINGLE W/PREAMP 20-SSOP RoHS:否 類別:集成電路 (IC) >> 線性 - 放大器 - 專用 系列:X-AMP® 產(chǎn)品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:60 系列:- 類型:可變增益放大器 應用:CATV 安裝類型:表面貼裝 封裝/外殼:20-WQFN 裸露焊盤 供應商設備封裝:20-TQFN-EP(5x5) 包裝:托盤
AD8331ARQZ 功能描述:IC VGA SINGLE W/PREAMP 20-QSOP RoHS:是 類別:集成電路 (IC) >> 線性 - 放大器 - 專用 系列:X-AMP® 產(chǎn)品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:60 系列:- 類型:可變增益放大器 應用:CATV 安裝類型:表面貼裝 封裝/外殼:20-WQFN 裸露焊盤 供應商設備封裝:20-TQFN-EP(5x5) 包裝:托盤
AD8331ARQZ 制造商:Analog Devices 功能描述:IC AMP VARIABLE GAIN 8331 QSOP20
AD8331ARQZ-R7 功能描述:IC AMP VAR GAIN 1CHAN 20QSOP RoHS:是 類別:集成電路 (IC) >> 線性 - 放大器 - 專用 系列:X-AMP® 產(chǎn)品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:60 系列:- 類型:可變增益放大器 應用:CATV 安裝類型:表面貼裝 封裝/外殼:20-WQFN 裸露焊盤 供應商設備封裝:20-TQFN-EP(5x5) 包裝:托盤
AD8331ARQZ-RL 功能描述:IC VGA SINGLE W/PREAMP 20QSOP RoHS:是 類別:集成電路 (IC) >> 線性 - 放大器 - 專用 系列:X-AMP® 產(chǎn)品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:60 系列:- 類型:可變增益放大器 應用:CATV 安裝類型:表面貼裝 封裝/外殼:20-WQFN 裸露焊盤 供應商設備封裝:20-TQFN-EP(5x5) 包裝:托盤