參數(shù)資料
型號: AD8331ARQZ
廠商: Analog Devices Inc
文件頁數(shù): 54/56頁
文件大?。?/td> 0K
描述: IC VGA SINGLE W/PREAMP 20-QSOP
設(shè)計資源: Interfacing the High Frequency AD8331 to AD9215 (CN0096)
標(biāo)準(zhǔn)包裝: 56
系列: X-AMP®
類型: 可變增益放大器
應(yīng)用: 信號處理
安裝類型: 表面貼裝
封裝/外殼: 20-SSOP(0.154",3.90mm 寬)
供應(yīng)商設(shè)備封裝: 20-QSOP
包裝: 管件
產(chǎn)品目錄頁面: 775 (CN2011-ZH PDF)
配用: AD8331-EVALZ-ND - BOARD EVAL FOR AD8331
AD8331/AD8332/AD8334
Rev. G | Page 7 of 56
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Rating
Voltage
Supply Voltage (VPSn, VPSV, VPSL, VPOS)
5.5 V
Input Voltage (INHx)
VS + 200 mV
ENB, ENBL, ENBV, HILO Voltage
VS + 200 mV
GAIN Voltage
2.5 V
Power Dissipation
RU Package1 (AD8332)
0.96 W
CP-32 Package (AD8332)
1.97 W
RQ Package1 (AD8331)
0.78 W
CP-64 Package (AD8334)
0.91 W
Temperature
Operating Temperature Range
40°C to +85°C
Storage Temperature Range
65°C to +150°C
Lead Temperature (Soldering 60 sec)
300°C
θJA
RU Package1 (AD8332)
68°C/W
CP-32 Package22 (AD8332)
33°C/W
RQ Package1 (AD8331)
83°C/W
CP-64 Package3 (AD8334)
24.2°C/W
1 4-layer JEDEC board (2S2P).
2 Exposed pad soldered to board, nine thermal vias in pad—JEDEC, 4-layer
board J-STD-51-9.
3 Exposed pad soldered to board, 25 thermal vias in pad—JEDEC, 4-layer
board J-STD-51-9.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
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