參數(shù)資料
型號(hào): AD8332ARU
廠商: Analog Devices Inc
文件頁(yè)數(shù): 54/56頁(yè)
文件大?。?/td> 0K
描述: IC VGA DUAL W/PREAMP LN 28-TSSOP
標(biāo)準(zhǔn)包裝: 1
系列: X-AMP®
類型: 可變?cè)鲆娣糯笃?br>
應(yīng)用: 信號(hào)處理
安裝類型: 表面貼裝
封裝/外殼: 28-TSSOP(0.173",4.40mm 寬)
供應(yīng)商設(shè)備封裝: 28-TSSOP
包裝: 管件
配用: AD8332-EVALZ-ND - BOARD EVAL FOR AD8332
AD8331/AD8332/AD8334
Rev. G | Page 7 of 56
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Rating
Voltage
Supply Voltage (VPSn, VPSV, VPSL, VPOS)
5.5 V
Input Voltage (INHx)
VS + 200 mV
ENB, ENBL, ENBV, HILO Voltage
VS + 200 mV
GAIN Voltage
2.5 V
Power Dissipation
RU Package1 (AD8332)
0.96 W
CP-32 Package (AD8332)
1.97 W
RQ Package1 (AD8331)
0.78 W
CP-64 Package (AD8334)
0.91 W
Temperature
Operating Temperature Range
40°C to +85°C
Storage Temperature Range
65°C to +150°C
Lead Temperature (Soldering 60 sec)
300°C
θJA
RU Package1 (AD8332)
68°C/W
CP-32 Package22 (AD8332)
33°C/W
RQ Package1 (AD8331)
83°C/W
CP-64 Package3 (AD8334)
24.2°C/W
1 4-layer JEDEC board (2S2P).
2 Exposed pad soldered to board, nine thermal vias in pad—JEDEC, 4-layer
board J-STD-51-9.
3 Exposed pad soldered to board, 25 thermal vias in pad—JEDEC, 4-layer
board J-STD-51-9.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
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