參數(shù)資料
型號: AD8336ACPZ-RL
廠商: Analog Devices Inc
文件頁數(shù): 17/28頁
文件大?。?/td> 0K
描述: IC VGA GP SGL-ENDED 16-LFCSP
標(biāo)準(zhǔn)包裝: 5,000
系列: X-AMP®
類型: 可變增益放大器
應(yīng)用: 信號處理
安裝類型: 表面貼裝
封裝/外殼: 16-VQFN 裸露焊盤,CSP
供應(yīng)商設(shè)備封裝: 16-LFCSP-VQ EP(4x4)
包裝: 帶卷 (TR)
配用: AD8336-EVALZ-ND - BOARD EVALUATION FOR AD8336
AD8336
Rev. C | Page 24 of 28
EVALUATION BOARD
An evaluation board, AD8336-EVALZ, is available online for
the AD8336. Figure 82 is a photo of the board.
The board is shipped from the factory configured for a non-
inverting preamp gain of 4×. To change the value of the gain
of the preamp or to change the gain polarity to inverting, alter
the component values or install components in the alternate
locations provided. All components are standard 0603 size, and
the board is compliant with RoHS requirements. Table 6 shows
the components to be removed and added to change the amplifier
configuration to inverting gain.
Table 6. Component Changes for Inverting Configuration
Remove
Install
R4, R7
R5, R6
OPTIONAL CIRCUITRY
The AD8336 features differential inputs for the gain control,
permitting nonzero or floating gain control inputs. To avoid any
delay in making the board operational, the gain input circuit is
shipped with Pin GNEG connected to ground via a 0 Ω resistor
in the R17 location. The user can adjust the gain of the device
by driving the GPOS test loop with a power supply or voltage
reference. Optional resistor networks R15/R17 and R13/R14
provide fixed-gain bias voltages at Pin GNEG and Pin GPOS for
non-zero common-mode voltages. The gain control can also be
driven with an active input such as a ramp. Provision is made for
an optional SMA connector at PRVG for monitoring the preamp
output or for driving the VGA from an external source. Remove
the 0 Ω resistor at R9 to isolate the preamp from an external
generator. The capacitor at Location C1 limits the bandwidth
of the preamplifier.
BOARD LAYOUT CONSIDERATIONS
The evaluation board uses four layers, with power and ground
planes located between two conductor layers. This arrangement
is highly recommended for customers, and several views of the
board are provided as reference for board layout details. When
laying out a printed circuit board for the AD8336, remember to
provide a pad beneath the device to solder the exposed pad of
the matching device. The pad in the board should have at least
five vias to provide a thermal path for the chip scale package.
Unlike leaded devices, the thermal pad is the primary means
to remove heat dissipated within the device.
062
28
-08
3
Figure 82. AD8336 Evaluation Board
06
22
8-
08
4
Figure 83. Component Side Copper
062
28
-0
85
Figure 84. Secondary Side Copper
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參數(shù)描述
AD8336ACPZ-WP 功能描述:IC VGA GP SGL-ENDED 16-LFCSP RoHS:是 類別:集成電路 (IC) >> 線性 - 放大器 - 專用 系列:X-AMP® 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:60 系列:- 類型:可變增益放大器 應(yīng)用:CATV 安裝類型:表面貼裝 封裝/外殼:20-WQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:20-TQFN-EP(5x5) 包裝:托盤
AD8336-EVALZ 功能描述:BOARD EVALUATION FOR AD8336 RoHS:是 類別:編程器,開發(fā)系統(tǒng) >> 評估板 - 運算放大器 系列:X-AMP® 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:1 系列:-
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