V
參數(shù)資料
型號: AD8390ACP-R2
廠商: Analog Devices Inc
文件頁數(shù): 12/16頁
文件大?。?/td> 0K
描述: IC AMP DIFF LP LDIST 16LFCSP
標(biāo)準(zhǔn)包裝: 1
放大器類型: 差分
電路數(shù): 1
輸出類型: 差分
轉(zhuǎn)換速率: 300 V/µs
-3db帶寬: 60MHz
電流 - 輸入偏壓: 4µA
電壓 - 輸入偏移: 1000µV
電流 - 電源: 10mA
電流 - 輸出 / 通道: 400mA
電壓 - 電源,單路/雙路(±): 10 V ~ 24 V,±5 V ~ 12 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 16-VQFN 裸露焊盤,CSP
供應(yīng)商設(shè)備封裝: 16-LFCSP-VQ
包裝: 標(biāo)準(zhǔn)包裝
其它名稱: AD8390ACP-R2DKR
AD8390
Rev. C | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Rating
Supply Voltage
±13.2 V (26.4 V)
VOCM
VEE < VOCM < VCC
Package Power Dissipation
(TJ MAX – TA)/θJA
Maximum Junction Temperature (TJ MAX)
150°C
Operating Temperature Range (TA)
–40°C to +85°C
Storage Temperature Range
–65°C to +150°C
Lead Temperature (Soldering 10 s)
300°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
TYPICAL THERMAL PROPERTIES
Table 4.
Package
Typical Thermal Resistance (θJA)
16-lead LFCSP (CP-16)
JEDEC 2S2P – 0 airflow
Paddle soldered to board
Nine thermal vias in pad
30.4°C/W
16-lead QSOP/EP (RC-16)
JEDEC 1S2P – 0 airflow
Paddle soldered to board
Nine thermal vias in pad
44.3°C/W
03600-0-003
RF = 10k
RG = 1k
49.9
49.9
RG = 1k
VIN
RL,DM = 100
RF = 10k
AD8390
VOUT,DM
Figure 3. Basic Test Circuit
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
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