參數(shù)資料
型號: AD8641ARZ
廠商: Analog Devices Inc
文件頁數(shù): 12/16頁
文件大?。?/td> 0K
描述: IC OPAMP JFET R-R 3.5MHZ 8SOIC
產(chǎn)品培訓(xùn)模塊: Top Five Problems in Photodiode Opamp Circuits
標(biāo)準(zhǔn)包裝: 98
放大器類型: J-FET
電路數(shù): 1
輸出類型: 滿擺幅
轉(zhuǎn)換速率: 3 V/µs
增益帶寬積: 3.5MHz
電流 - 輸入偏壓: 0.25pA
電壓 - 輸入偏移: 70µV
電流 - 電源: 200µA
電流 - 輸出 / 通道: 12mA
電壓 - 電源,單路/雙路(±): 5 V ~ 26 V,±2.5 V ~ 13 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 8-SOIC(0.154",3.90mm 寬)
供應(yīng)商設(shè)備封裝: 8-SO
包裝: 管件
產(chǎn)品目錄頁面: 774 (CN2011-ZH PDF)
Data Sheet
AD8641/AD8642/AD8643
Rev. E | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Absolute maximum ratings apply at 25°C, unless otherwise noted.
Table 3.
Parameter
Rating
Supply Voltage
27.3 V
Input Voltage
VS to VS+
Differential Input Voltage
±Supply Voltage
Output Short-Circuit Duration
Indefinite
Storage Temperature Range
KS-5, R-8, RM-8, R-14, CP-16 Packages
65°C to +150°C
Operating Temperature Range
40°C to +125°C
Junction Temperature Range
KS-5, R-8, RM-8, R-14, CP-16 Packages
65°C to +150°C
Lead Temperature (Soldering, 60 sec)
300°C
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages. This
was measured using a standard 4-layer board. For the LFCSP
package, solder the exposed pad to a copper plane, which
should be connected to V+.
Table 4.
Package Type
θJA
θJC
Unit
5-Lead SC70 (KS)
430
149
°C/W
8-Lead SOIC (R)
121
43
°C/W
8-Lead MSOP (RM)
142
45
°C/W
14-Lead SOIC (R)
110
36
°C/W
16-Lead LFCSP (CP)
81
16
°C/W
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
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