參數(shù)資料
型號: AD8659ARZ
廠商: Analog Devices Inc
文件頁數(shù): 21/24頁
文件大?。?/td> 0K
描述: IC OPAMP RRIO 18V CMOS 14SOIC
標準包裝: 56
放大器類型: 通用
電路數(shù): 4
輸出類型: 滿擺幅
轉(zhuǎn)換速率: 0.07 V/µs
增益帶寬積: 200kHz
電流 - 輸入偏壓: 5pA
電壓 - 輸入偏移: 350µV
電流 - 電源: 18µA
電流 - 輸出 / 通道: 12mA
電壓 - 電源,單路/雙路(±): 2.7 V ~ 18 V,±1.35 V ~ 9 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 14-SOIC(0.154",3.90mm 寬)
供應商設備封裝: 14-SO
包裝: 管件
AD8657/AD8659
Data Sheet
Rev. B | Page 6 of 24
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
Rating
Supply Voltage
20.5 V
Input Voltage
(V) 300 mV to (V+) + 300 mV
Input Current1
±10 mA
Differential Input Voltage
±V
SY
Output Short-Circuit
Duration to GND
Indefinite
Temperature Ranges
Storage
65°C to +150°C
Operating
40°C to +125°C
Junction
65°C to +150°C
Lead Temperature
(Soldering, 60 sec)
300°C
1 The input pins have clamp diodes to the power supply pins. Limit the input
current to 10 mA or less whenever input signals exceed the power supply
rail by 0.3 V.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages using a
standard 4-layer JEDEC board. The exposed pad (LFCSP
packages only) is soldered to the board.
Table 6. Thermal Resistance
Package Type
θ
JA
θ
JC
Unit
8-Lead MSOP (RM-8)
142
45
°C/W
8-Lead LFCSP (CP-8-11)
75
12
°C/W
14-Lead SOIC (R-14)
115
36
°C/W
16-Lead LFCSP (CP-16-20)
52
13
°C/W
ESD CAUTION
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