參數(shù)資料
型號: AD8674ARU
廠商: Analog Devices Inc
文件頁數(shù): 16/20頁
文件大?。?/td> 0K
描述: IC OPAMP GP 10MHZ QUAD 14TSSOP
產(chǎn)品變化通告: AD8674 Datasheet Specification Change 25/Nov/2009
標準包裝: 96
放大器類型: 通用
電路數(shù): 4
轉(zhuǎn)換速率: 4 V/µs
增益帶寬積: 10MHz
電流 - 輸入偏壓: 3nA
電壓 - 輸入偏移: 20µV
電流 - 電源: 3mA
電流 - 輸出 / 通道: 20mA
電壓 - 電源,單路/雙路(±): 10 V ~ 36 V,±5 V ~ 18 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 14-TSSOP(0.173",4.40mm 寬)
供應商設備封裝: 14-TSSOP
包裝: 管件
Data Sheet
AD8671/AD8672/AD8674
Rev. F | Page 5 of 20
ABSOLUTE MAXIMUM RATINGS
Table 4.1
Parameter
Rating
Supply Voltage
36 V
Input Voltage
VS– to VS+
Differential Input Voltage
±0.7 V
Output Short-Circuit Duration
Indefinite
Storage Temperature Range
All Packages
–65°C to +150°C
Operating Temperature Range
8-Lead Packages
–40°C to +125°C
14-Lead Packages
–40°C to +85°C
Junction Temperature Range
All Packages
–65°C to +150°C
Lead Temperature Range (Soldering, 60 sec)
300°C
1
Absolute maximum ratings apply at 25°C, unless otherwise noted.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
See the Applications section for a related discussion on power.
Table 5. Package Characteristics
Package Type
θJA1
θJC
Unit
8-Lead MSOP (RM)
142
44
°C/W
8-Lead SOIC_N (R)
120
43
°C/W
14-Lead SOIC_N (R)
90
36
°C/W
14-Lead TSSOP (RU)
112
35
°C/W
1
θJA is specified for the worst-case conditions, that is., θJA is specified for the
device soldered on a 4-layer circuit board for surface-mount packages.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
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