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AD9501
REV. A
–3–
Package
Option*
Device
T emperature
Description
AD9501JN
AD9501JP
AD9501JQ
AD9501SQ
0
°
C to +70
°
C
0
°
C to +70
°
C
0
°
C to +70
°
C
–55
°
C to +125
°
C
20-Pin Plastic DIP
20-Lead PLCC
20-Pin Ceramic DIP
20-Pin Ceramic DIP
N-20
P-20A
Q-20
Q-20
*N = Plastic DIP; P = Plastic Leaded Chip Carrier; Q = Cerdip.
NOT ES
Absolute maximum ratings are limiting values, to be applied individually, and beyond which the serviceability of the circuit may be impaired. Functional operability
is not necessarily implied. Exposure to absolute maximum rating conditions for an extended period of time may affect device reliability.
2
T ypical thermal impedances: 20-lead plastic leaded chip carrier
θ
JA
= 73
°
C/W;
θ
JC
= 29
°
C/W. 20-pin ceramic DIP
θ
JA
= 65
°
C/W;
θ
JC
= 20
°
C/W. 20-pin plastic DIP
θ
= 65
°
C/W;
θ
= 26
°
C/W.
3
Digital data inputs must remain stable for the specified time prior to the positive transition of the LAT CH signal.
4
Digital data inputs must remain stable for the specified time after the positive transition of the LAT CH signal.
5
Programmed delay (t
) = 0 ns. Maximum self-resetting trigger rate is limited to 6.9 MHz with 100 ns programmed delay. If t
D
= 0 ns and external RESET signal is
used, maximum trigger rate is 23 MHz.
6
Programmed delay (t
D
) = 0 ns. In operation, any programmed delays are in addition to the minimum propagation delay (t
PD
).
7
Programmed delay (t
) = 0 ns. [Minimum propagation delay (t
)].
8
Measured from 50% transition point of the RESET signal input to the 50% transition point of the falling edge of the output.
9
Minimum time from the falling edge of RESET to the triggering input to insure valid output pulse, using external RESET pulse.
10
Minimum time from triggering event to rising edge of RESET to insure valid output event, using external RESET pulse. Extends to 125 ns when programmed delay
is 100 ns.
11
When self-resetting with a full-scale programmed delay.
12
Measured from +0.4 V to +2.4 V; source = 1 mA; sink = 4 mA.
13
Measured from the data input to the time when the AD9501 becomes 8-bit accurate, after a full-scale change in the program delay data word.
14
Measured from the RESET input to the time when the AD9501 becomes 8-bit accurate, after a full-scale programmed delay.
15
Supply voltage should remain stable within
±
5% for normal operation.
16
Measured at +V
S
= +5.0 V
±
5%; specification shown is for worst case.
Specifications subject to change without notice.
E X PLANAT ION OF T E ST LE VE LS
T est Level
I
–
II –
100% production tested.
100% production tested at +25
°
C, and sample tested at specified
temperatures.
Sample tested only.
Parameter is guaranteed by design and characterization testing.
Parameter is a typical value only.
All devices are 100% production tested at +25
°
C. 100% production
tested at temperature extremes for extended temperature devices;
sample tested at temperature extremes for commercial/industrial
devices.
III –
IV –
V
VI –
–
ORDE RING GUIDE
DIE LAY OUT AND ME CHANICAL INFORMAT ION
ME CHANICAL INFORMAT ION
Die Dimensions . . . . . . . . . . . . . . . . . . 89
×
153
×
15 (
±
2) mils
Pad Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
×
4 mils
Metalization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Aluminum
Backing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . None
Substrate Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ground
Passivation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Oxynitride
Die Attach . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Gold Eutectic
Bond Wire . . . . . . . . 1.25 mil, Aluminum; Ultrasonic Bonding
or 1 mil, Gold; Gold Ball Bonding