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AD9838
Rev. A | Page 6 of 32
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Parameter
Rating
AVDD to AGND
0.3 V to +6 V
DVDD to DGND
0.3 V to +6 V
AVDD to DVDD
0.3 V to +0.3 V
AGND to DGND
0.3 V to +0.3 V
CAP/2.5V
2.75 V
Digital I/O Voltage to DGND
0.3 V to DVDD + 0.3 V
Analog I/O Voltage to AGND
0.3 V to AVDD + 0.3 V
Operating Temperature Range
Industrial (B Version)
40°C to +125°C
Storage Temperature Range
65°C to +150°C
Maximum Junction Temperature
150°C
Lead Temperature, Soldering (10 sec)
300°C
IR Reflow, Peak Temperature
220°C
Reflow Soldering (Pb Free)
Peak Temperature
260°C (+0/5)
Time at Peak Temperature
10 sec to 40 sec
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type
θJA
θJC
Unit
20-Lead LFCSP_WQ (CP-20-10)
49.5
5.3
°C/W
ESD CAUTION