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參數(shù)資料
| 型號： | ADA4430-1YKSZ-R7 |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 16/20頁 |
| 文件大小： | 0K |
| 描述： | IC FILTER VIDEO ULTRA LP SC70-6 |
| 設(shè)計資源： | Reconstruction Video Filter Using ADA4430-1 Amplifier After ADV7393 Video Encoder (CN0101) |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 類型： | 視頻濾波器 |
| 應(yīng)用： | DVD，游戲控制臺，媒體播放器 |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 6-TSSOP，SC-88，SOT-363 |
| 供應(yīng)商設(shè)備封裝： | SC-70-6 |
| 包裝： | 標(biāo)準(zhǔn)包裝 |
| 產(chǎn)品目錄頁面： | 776 (CN2011-ZH PDF) |
| 其它名稱： | ADA4430-1YKSZ-R7DKR |
ADA4430-1
Rev. C | Page 5 of 20
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Rating
Supply Voltage
6 V
Power Dissipation
See Figure 3
Storage Temperature Range
65°C to +125°C
Operating Temperature Range
40°C to +125°C
Lead Temperature (Soldering 10 sec)
300°C
Junction Temperature
150°C
The power dissipated in the package (PD) is the sum of the
quiescent power dissipation and the power dissipated in the
package due to the load drive. The quiescent power is the
voltage between the supply pins (VS) times the quiescent
current (IS). The power dissipated due to the load drive depends
upon the particular application. The power due to load drive is
calculated by multiplying the load current by the associated
voltage drop across the device. RMS voltages and currents must
be used in these calculations.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Airflow increases heat dissipation, effectively reducing θJA. In
addition, more metal directly in contact with the package leads
from metal traces, through holes, ground, and power planes
reduces the θJA.
Figure 3 shows the maximum safe power dissipation in the
package vs. the ambient temperature for the 6-lead SC70
(430°C/W) and the 6-lead SOT-23 (170°C/W) on a JEDEC
standard 4-layer board.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, θJA is
specified for a device soldered in the circuit board.
05
88
5-
00
2
1.2
1.0
0.8
0.6
0.4
0.2
0
–40
120
100
80
60
40
020
–20
M
A
XI
M
U
M
PO
W
E
R
D
ISSI
PA
T
IO
N
(W)
AMBIENT TEMPERATURE (°C)
SOT-23
SC70
Table 4. Thermal Resistance
Package Type
θJA
Unit
6-Lead SC70
430
°C/W
6-Lead SOT-23
170
°C/W
Maximum Power Dissipation
The maximum safe power dissipation in the ADA4430-1
package is limited by the associated rise in junction temperature
(TJ) on the die. At approximately 150°C, which is the glass
transition temperature, the plastic changes its properties. Even
temporarily exceeding this temperature limit can change the
stresses that the package exerts on the die, permanently shifting
the parametric performance of the ADA4430-1. Exceeding a
junction temperature of 150°C for an extended period can
result in changes in the silicon devices, potentially causing
failure.
Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
ESD CAUTION
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