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| 型號： | ADA4857-1YRZ-R7 |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 17/20頁 |
| 文件大小： | 0K |
| 描述： | IC OPAMP VF ULDIST LP LN 8SOIC |
| 標(biāo)準(zhǔn)包裝： | 1,000 |
| 放大器類型： | 電壓反饋 |
| 電路數(shù)： | 1 |
| 轉(zhuǎn)換速率： | 2800 V/µs |
| -3db帶寬： | 850MHz |
| 電流 - 輸入偏壓： | 2µA |
| 電壓 - 輸入偏移： | 2000µV |
| 電流 - 電源： | 5mA |
| 電流 - 輸出 / 通道： | 50mA |
| 電壓 - 電源，單路/雙路(±)： | 4.5 V ~ 10.5 V，±2.25 V ~ 5.25 V |
| 工作溫度： | -40°C ~ 125°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 8-SOIC（0.154"，3.90mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 8-SO |
| 包裝： | 帶卷 (TR) |
ADA4857-1/ADA4857-2
Data Sheet
Rev. C | Page 6 of 20
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Rating
Supply Voltage
11 V
Power Dissipation
Common-Mode Input Voltage
VS + 0.7 V to +VS 0.7 V
Differential Input Voltage
±VS
Exposed Paddle Voltage
VS
Storage Temperature Range
65°C to +125°C
Operating Temperature Range
40°C to +125°C
Lead Temperature (Soldering, 10 sec)
300°C
Junction Temperature
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, θJA is specified
for device soldered in circuit board for surface-mount packages.
Table 4.
Package Type
θJA
θJC
Unit
8-Lead SOIC
115
15
°C/W
8-Lead LFCSP
94.5
34.8
°C/W
16-Lead LFCSP
68.2
19
°C/W
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation for the ADA4857 is
limited by the associated rise in junction temperature (TJ) on
the die. At approximately 150°C, which is the glass transition
temperature, the properties of the plastic change. Even temporarily
exceeding this temperature limit may change the stresses that
the package exerts on the die, permanently shifting the parametric
performance of the ADA4857. Exceeding a junction temperature of
175°C for an extended period can result in changes in silicon
devices, potentially causing degradation or loss of functionality.
The power dissipated in the package (PD) is the sum of the
quiescent power dissipation and the power dissipated in the
die due to the ADA4857 drive at the output. The quiescent
power is the voltage between the supply pins (VS) times the
quiescent current (IS).
PD = Quiescent Power + (Total Drive Power Load Power)
(
)
L
OUT
L
OUT
S
D
R
V
R
V
I
V
P
2
–
2
×
+
×
=
RMS output voltages should be considered. If RL is referenced
to VS, as in single-supply operation, the total drive power is
VS × IOUT. If the rms signal levels are indeterminate, consider the
worst case, when VOUT = VS/4 for RL to midsupply.
(
) (
)
L
S
D
R
V
I
V
P
2
4
/
+
×
=
In single-supply operation with RL referenced to VS, the worst
case is VOUT = VS/2.
Airflow increases heat dissipation, effectively reducing θJA.
In addition, more metal directly in contact with the package
leads and exposed paddle from metal traces, through holes,
ground, and power planes reduces θJA.
Figure 4 shows the maximum power dissipation in the package
vs. the ambient temperature for the SOIC and LFCSP packages
on a JEDEC standard 4-layer board. θJA values are approximations.
0
0.5
1.0
1.5
2.0
2.5
3.0
–40 –30 –20 –10 0
10 20 30 40 50 60 70 80 90 100 110 120
07040-
004
AMBIENT TEMPERATURE (°C)
MA
XI
MU
M
PO
W
ER
D
ISSI
PA
T
IO
N
(W
)
ADA4857-1 (SOIC)
ADA4857-1 (LFCSP)
ADA4857-2 (LFCSP)
Figure 4. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
ESD CAUTION
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ADA4857-1YRZ-RL | 功能描述:IC OPAMP VF ULDIST LP LN 8SOIC RoHS:是 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 標(biāo)準(zhǔn)包裝:1,000 系列:- 放大器類型:電壓反饋 電路數(shù):4 輸出類型:滿擺幅 轉(zhuǎn)換速率:33 V/µs 增益帶寬積:20MHz -3db帶寬:30MHz 電流 - 輸入偏壓:2nA 電壓 - 輸入偏移:3000µV 電流 - 電源:2.5mA 電流 - 輸出 / 通道:30mA 電壓 - 電源，單路/雙路(±):4.5 V ~ 16.5 V，±2.25 V ~ 8.25 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:14-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:14-SOIC 包裝:帶卷 (TR) |
| ADA4857-2 | 制造商:AD 制造商全稱:Analog Devices 功能描述:Ultralow Distortion, Low Power, Low Noise, High Speed Op Amp |
| ADA4857-2YCP-EBZ | 功能描述:BOARD EVAL FOR ADA4857-2YCP RoHS:是 類別:編程器，開發(fā)系統(tǒng) >> 評估板 - 運(yùn)算放大器 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:1 系列:- |
| ADA4857-2YCPZ-R2 | 制造商:Analog Devices 功能描述:OP Amp Dual Volt Fdbk 制造商:Analog Devices 功能描述:OP AMP DUAL VOLT FDBK 5.25V/10.5V 16LFCSP EP - Tape and Reel 制造商:Analog Devices 功能描述:OP Amp Dual Volt Fdbk }5.25V/10.5V 16-Pin LFCSP EP |
| ADA4857-2YCPZ-R7 | 功能描述:IC OPAMP VF DUAL ULDIST 16LFCSP RoHS:是 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 產(chǎn)品培訓(xùn)模塊:Differential Circuit Design Techniques for Communication Applications 標(biāo)準(zhǔn)包裝:1 系列:- 放大器類型:RF/IF 差分 電路數(shù):1 輸出類型:差分 轉(zhuǎn)換速率:9800 V/µs 增益帶寬積:- -3db帶寬:2.9GHz 電流 - 輸入偏壓:3µA 電壓 - 輸入偏移:- 電流 - 電源:40mA 電流 - 輸出 / 通道:- 電壓 - 電源，單路/雙路(±):3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:16-VQFN 裸露焊盤，CSP 供應(yīng)商設(shè)備封裝:16-LFCSP-VQ 包裝:剪切帶 (CT) 產(chǎn)品目錄頁面:551 (CN2011-ZH PDF) 其它名稱:ADL5561ACPZ-R7CT |
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