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參數(shù)資料
| 型號： | ADA4950-2YCPZ-RL |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 16/28頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC AMP DIFF DUAL 114MA 24LFCSP |
| 標(biāo)準(zhǔn)包裝： | 5,000 |
| 放大器類型： | 差分 |
| 電路數(shù)： | 2 |
| 輸出類型： | 差分 |
| 轉(zhuǎn)換速率： | 2900 V/µs |
| -3db帶寬： | 750MHz |
| 電壓 - 輸入偏移： | 200µV |
| 電流 - 電源： | 9.5mA |
| 電流 - 輸出 / 通道： | 114mA |
| 電壓 - 電源，單路/雙路(±)： | 3 V ~ 11 V，±1.5 V ~ 5.5 V |
| 工作溫度： | -40°C ~ 105°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 24-VFQFN 裸露焊盤，CSP |
| 供應(yīng)商設(shè)備封裝： | 24-LFCSP-VQ（4x4） |
| 包裝： | 帶卷 (TR) |
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Data Sheet
ADA4950-1/ADA4950-2
Rev. A | Page 23 of 28
LAYOUT, GROUNDING, AND BYPASSING
As a high speed device, the ADA4950-x is sensitive to the
PCB environment in which it operates. Realizing its superior
performance requires attention to the details of high speed
PCB design.
The first requirement is a solid ground plane that covers as
much of the board area around the ADA4950-x as possible. The
thermal resistance, θJA, is specified for the device, including the
exposed pad, soldered to a high thermal conductivity 4-layer
circuit board, as described in EIA/JESD51-7.
Bypass the power supply pins as close to the device as possible
and directly to a nearby ground plane. Use high frequency
ceramic chip capacitors. It is recommended that two parallel
bypass capacitors (1000 pF and 0.1 μF) be used for each supply.
Place the 1000 pF capacitor closer to the device. Farther away,
provide low frequency bulk bypassing using 10 μF tantalum
capacitors from each supply to ground.
Signal routing should be short and direct to avoid parasitic
effects. Wherever complementary signals exist, provide a
symmetrical layout to maximize balanced performance. When
routing differential signals over a long distance, keep PCB
traces close together, and twist any differential wiring to
minimize loop area. Doing this reduces radiated energy and
makes the circuit less susceptible to interference.
1.30
0.80
1.30
07
95
7-
0
56
Figure 61. Recommended PCB Thermal Attach Pad (Dimensions in Millimeters)
0.30
PLATED
VIA HOLE
1.30
GROUND PLANE
POWER PLANE
BOTTOM METAL
TOP METAL
07
95
7-
05
7
Figure 62. Cross-Section of 4-Layer PCB Showing Thermal Via Connection to Buried Ground Plane (Dimensions in Millimeters)
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ADA4960-1 | 制造商:AD 制造商全稱:Analog Devices 功能描述:Low Distortion Ultrahigh Speed Differential ADC Driver |
| ADA4960-1ACPZ-R2 | 功能描述:IC ADC DRIVER DIFF 16LFCSP RoHS:是 類別:集成電路 (IC) >> 線性 - 放大器 - 專用 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:60 系列:- 類型:可變增益放大器 應(yīng)用:CATV 安裝類型:表面貼裝 封裝/外殼:20-WQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:20-TQFN-EP（5x5） 包裝:托盤 |
| ADA4960-1ACPZ-R7 | 功能描述:IC ADC DRIVER DIFF 16LFCSP RoHS:是 類別:集成電路 (IC) >> 線性 - 放大器 - 專用 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:60 系列:- 類型:可變增益放大器 應(yīng)用:CATV 安裝類型:表面貼裝 封裝/外殼:20-WQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:20-TQFN-EP（5x5） 包裝:托盤 |
| ADA4960-1ACPZ-RL | 功能描述:IC ADC DRIVER DIFF 16LFCSP RoHS:是 類別:集成電路 (IC) >> 線性 - 放大器 - 專用 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:60 系列:- 類型:可變增益放大器 應(yīng)用:CATV 安裝類型:表面貼裝 封裝/外殼:20-WQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:20-TQFN-EP（5x5） 包裝:托盤 |
| ADA4961ACPZN-R7 | 功能描述:RF Amplifier IC 1.8GHz ~ 3.2GHz 24-LFCSP (4x4) 制造商:analog devices inc. 系列:- 包裝:剪切帶（CT） 零件狀態(tài):在售 頻率:1.8GHz ~ 3.2GHz P1dB:17.8dBm 增益:18dB 噪聲系數(shù):5.5dB RF 類型:- 電壓 - 電源:3.3 V ~ 5 V 電流 - 電源:15mA 測試頻率:- 封裝/外殼:24-WFQFN 裸露焊盤 供應(yīng)商器件封裝:24-LFCSP（4x4） 標(biāo)準(zhǔn)包裝:1 |
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