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參數(shù)資料
| 型號： | ADF4213BCP |
| 廠商： | ANALOG DEVICES INC |
| 元件分類： | XO, clock |
| 英文描述： | Dual RF/IF PLL Frequency Synthesizers |
| 中文描述： | PLL FREQUENCY SYNTHESIZER, 3000 MHz, QCC20 |
| 封裝： | CSP-20 |
| 文件頁數(shù)： | 19/20頁 |
| 文件大?。?/td> | 251K |
| 代理商： | ADF4213BCP |
REV. A
ADF4210/ADF4211/ADF4212/ADF4213
–19–
PCB Guidelines for Chip Scale Package
The lands on the chip scale package (CP-20), are rectangular.
The printed circuit board pad for these should be 0.1 mm
longer than the package land length and 0.05 mm wider than
the package land width. The land should be centered on the
pad. This will ensure that the solder joint size is maximized.
The bottom of the chip scale package has a central thermal pad.
The thermal pad on the printed circuit board should be at least
as large as this exposed pad. On the printed circuit board, there
should be clearance of at least 0.25 mm between the thermal
pad and inner edges of the pad pattern. This will ensure that
shorting is avoided.
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
Thin Shrink Small Outline Package (TSSOP)
(RU-20)
20
11
10
1
0.256 (6.50)
0.246 (6.25)
0.177 (4.50)
0.169 (4.30)
PIN 1
0.006 (0.15)
0.002 (0.05)
0.260 (6.60)
0.252 (6.40)
SEATING
PLANE
0.0118 (0.30)
0.0075 (0.19)
0.0256 (0.65)
BSC
0.0433 (1.10)
MAX
0.0079 (0.20)
0.0035 (0.090)
0.028 (0.70)
0.020 (0.50)
8
0
Chip Scale Package
(CP-20)
1
20
5
6
11
16
15
BVIEW
10
0.080 (2.25)
0.083 (2.10) SQ
0.077 (1.95)
0.024 (0.60)
0.017 (0.42)
0.009 (0.24)
0.024 (0.60)
0.017 (0.42)
0.009 (0.24)
0.012 (0.30)
0.009 (0.23)
0.007 (0.18)
0.030 (0.75)
0.022 (0.60)
0.014 (0.50)
0.080 (2.00)
REF
0.010 (0.25)
MIN
0.020 (0.50)
BSC
12
MAX
0.008 (0.20)
REF
0.031 (0.80) MAX
0.026 (0.65) NOM
0.002 (0.05)
0.0004 (0.01)
0.0 (0.0)
0.035 (0.90) MAX
0.033 (0.85) NOM
SEATING
PLANE
CONTROLLING DIMENSIONS ARE IN MILLIMETERS
PIN 1
INDICATOR
TOP
0.148 (3.75)
BSC SQ
0.157 (4.0)
BSC SQ
Thermal vias may be used on the printed circuit board thermal
pad to improve thermal performance of the package. If vias are
used, they should be incorporated in the thermal pad at 1.2 mm
grid pitch. The via diameter should be between 0.3 mm and
0.33 mm and the via barrel should be plated with 1 oz. copper
to plug the via. The user should connect the printed circuit
board pad to AGND.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ADF4213BCPZ | 制造商:Analog Devices 功能描述:PLL Frequency Synthesizer Dual 20-Pin LFCSP EP 制造商:Rochester Electronics LLC 功能描述: |
| ADF4213BCPZ-RL | 功能描述:IC PLL FREQ SYNTHESIZER 20LFCSP RoHS:是 類別:集成電路 (IC) >> 時(shí)鐘/計(jì)時(shí) - 時(shí)鐘發(fā)生器，PLL，頻率合成器 系列:- 產(chǎn)品變化通告:Product Discontinuation 04/May/2011 標(biāo)準(zhǔn)包裝:96 系列:- 類型:時(shí)鐘倍頻器，零延遲緩沖器 PLL:帶旁路 輸入:LVTTL 輸出:LVTTL 電路數(shù):1 比率 - 輸入:輸出:1:8 差分 - 輸入:輸出:無/無 頻率 - 最大:133.3MHz 除法器/乘法器:是/無 電源電壓:3 V ~ 3.6 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:16-TSSOP（0.173"，4.40mm 寬） 供應(yīng)商設(shè)備封裝:16-TSSOP 包裝:管件 其它名稱:23S08-5HPGG |
| ADF4213BCPZ-RL7 | 制造商:Analog Devices 功能描述:PLL Frequency Synthesizer Dual 20-Pin LFCSP EP T/R |
| ADF4213BRU | 制造商:Rochester Electronics LLC 功能描述:DUAL PLL,2.5/1.1GHZ I.C - Bulk 制造商:Analog Devices 功能描述: |
| ADF4213BRU-REEL | 功能描述:IC PLL FREQ SYNTHESIZER 20-TSSOP RoHS:否 類別:集成電路 (IC) >> 時(shí)鐘/計(jì)時(shí) - 時(shí)鐘發(fā)生器，PLL，頻率合成器 系列:- 標(biāo)準(zhǔn)包裝:27 系列:Precision Edge® 類型:頻率合成器 PLL:是 輸入:PECL，晶體 輸出:PECL 電路數(shù):1 比率 - 輸入:輸出:1:1 差分 - 輸入:輸出:無/是 頻率 - 最大:800MHz 除法器/乘法器:是/無 電源電壓:3.135 V ~ 5.25 V 工作溫度:0°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:28-SOIC（0.295"，7.50mm 寬） 供應(yīng)商設(shè)備封裝:28-SOIC 包裝:管件 |
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