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ADG1308/ADG1309
Rev. A | Page 6 of
16
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Parameter
Rating
VDD to VSS
35 V
VDD to GND
0.3 V to +25 V
VSS to GND
+0.3 V to 25 V
VSS 0.3 V to VDD + 0.3 V or
30 mA (whichever occurs first)
Continuous Current, S or D pins
30 mA
Peak Current, S or D pins
(Pulsed at 1 ms, 10% Duty
Cycle Maximum)
100 mA
Operating Temperature Range
Industrial (B Version)
–40°C to +105°C
Storage Temperature Range
–65°C to +150°C
Junction Temperature
150°C
TSSOP, θJA,
Thermal Impedance
112°C/W
16-Lead SOIC, θJA,
Thermal Impedance
77°C/W
Reflow Soldering Peak
Temperature (Pb-free)
260 (+0/5)°C
1 Overvoltages at A, EN, S, or D pins are clamped by internal diodes. Current
should be limited to the maximum ratings provided.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.