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ADG1433/ADG1434
Rev. C | Page 7 of 20
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 4.
Parameter
Rating
VDD to VSS
35 V
VDD to GND
0.3 V to +25 V
VSS to GND
25 V to +0.3 V
Analog Inputs, Digital In
puts1VSS 0.3 V to VDD + 0.3 V or
30 mA, whichever occurs first
Peak Current, S or D (Pulsed at 1 ms,
250 mA
Continuous Current, S or
D2Data + 15%
Operating Temperature Range
Industrial (Y Version)
40°C to +125°C
Storage Temperature Range
65°C to +150°C
Junction Temperature
150°C
Reflow Soldering Peak
Temperature (Pb-Free)
260 (+ 0 to 5)°C
1 Overvoltages at A, EN, S, or D pins are clamped by internal diodes. Current
should be limited to the maximum ratings given.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one absolute maximum rating may be applied at any
one time.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 5.
Package Type
θJA
θJC
Unit
TSSOP
150.4
50
°C/W
LFCSP_VQ
30.4
N/A
°C/W
ESD CAUTION