REV. 0
ADG3246
–3–
ABSOLUTE MAXIMUM RATINGS
*
(TA = 25
°C, unless otherwise noted.)
VCC to GND . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to +4.6 V
Digital Inputs to GND . . . . . . . . . . . . . . . . . –0.5 V to +4.6 V
DC Input Voltage . . . . . . . . . . . . . . . . . . . . . –0.5 V to +4.6 V
DC Output Current . . . . . . . . . . . . . . . . . . 25 mA per channel
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . . –40
°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65
°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150
°C
LFCSP Package
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . . 35
°C/W
TSSOP Package
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 128
°C/W
Lead Temperature, Soldering (10 seconds) . . . . . . . . . . 300
°C
IR Reflow, Peak Temperature (<20 seconds) . . . . . . . . 235
°C
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
Table I. Pin Description
Mnemonic
Description
BE
Bus Enable (Active Low)
SEL
Level Translation Select
Ax
Port A, Inputs or Outputs
Bx
Port B, Inputs or Outputs
PIN CONFIGURATION
24-Lead LFCSP and TSSOP
PIN 1
INDICATOR
TOP VIEW
18
BE
17 B0
16 B1
15 B2
SEL 1
A5 2
A6 3
24
A4
14 B3
13 B4
GND
7
B9
8
B8
9
B7
10
B6
11
B5
1
2
A7 4
A8 5
A9 6
23
A3
22
A2
21
A1
20
A0
19
V
CC
ADG3246
GND
A6
A0
A1
A2
A5
A4
A3
B7
B6
B5
BE
B0
B1
B4
B3
B2
SEL
VCC
TOP VIEW
(Not to Scale)
24
23
22
21
20
19
18
17
16
15
14
13
1
2
3
4
5
6
7
8
9
10
11
12
ADG3246
A9
A8
A7
B8
B9
Table II. Truth Table
BE
SEL*
Function
LL
A = B, 3.3 V to 1.8 V Level Shifting
LH
A = B, 3.3 V to 2.5 V/2.5 V to 1.8 V Level Shifting
HX
Disconnect
*SEL = 0 only when VDD = 3.3 V
± 10%
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
ADG3246 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended
to avoid performance degradation or loss of functionality.
ORDERING GUIDE
Model
Temperature Range
Package Description
Package Option
ADG3246BCP
–40
°C to +85°CLead Frame Chip Scale Package (LFCSP)
CP-24
ADG3246BCP-REEL7
–40
°C to +85°CLead Frame Chip Scale Package (LFCSP)
CP-24
ADG3246BRU
–40
°C to +85°CThin Shrink Small Outline Package (TSSOP)
RU-24
ADG3246BRU-REEL7
–40
°C to +85°CThin Shrink Small Outline Package (TSSOP)
RU-24