TA = 25°C, unless otherwis" />
參數(shù)資料
型號: ADG408BRZ-REEL
廠商: Analog Devices Inc
文件頁數(shù): 13/16頁
文件大?。?/td> 0K
描述: IC MULTIPLEXER 8X1 16SOIC
產(chǎn)品培訓(xùn)模塊: Power Line Monitoring
Switch Fundamentals
標(biāo)準(zhǔn)包裝: 2,500
系列: LC²MOS
功能: 多路復(fù)用器
電路: 1 x 8:1
導(dǎo)通狀態(tài)電阻: 90 歐姆
電壓電源: 單/雙電源
電壓 - 電源,單路/雙路(±): 12V,±15V
電流 - 電源: 100µA
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 16-SOIC(0.154",3.90mm 寬)
供應(yīng)商設(shè)備封裝: 16-SOIC
包裝: 帶卷 (TR)
ADG408/ADG409
Rev. C | Page 6 of 16
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Parameter
Rating
VDD to VSS
44 V
VDD to GND
0.3 V to +32 V
VSS to GND
+0.3 V to 32 V
Analog, Digital Inputs
VSS 2 V to VDD + 2 V or 20 mA,
whichever occurs first
Continuous Current, S or D
20 mA
Peak Current, S or D
(Pulsed at 1 ms, 10% Duty Cycle
Maximum)
40 mA
Operating Temperature Range
Industrial (B Version)
40° C to +85°C
Extended (T Version)
55° C to +125°C
Storage Temperature Range
65° C to +150°C
Junction Temperature
150°C
CERDIP Package, Power Dissipation
900 mW
θJA, Thermal Impedance
76°C/W
Lead Temperature, Soldering
(10 sec)
300°C
PDIP Package, Power Dissipation
470 mW
θJA, Thermal Impedance
117°C/W
Lead Temperature, Soldering
(10 sec)
260°C
TSSOP Package, Power Dissipation
450 mW
θJA, Thermal Impedance
155°C/W
θJC, Thermal Impedance
50°C/W
SOIC Package, Power Dissipation
600 mW
θJA, Thermal Impedance
77°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec)
215°C
Infrared (15 sec)
220°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
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