TA= 25°C unless otherwise noted.<" />
參數(shù)資料
型號: ADG419BR-REEL
廠商: Analog Devices Inc
文件頁數(shù): 12/16頁
文件大小: 0K
描述: IC SWITCH SPDT 8SOIC
產(chǎn)品培訓(xùn)模塊: Switch Fundamentals
標(biāo)準(zhǔn)包裝: 2,500
系列: LC²MOS
功能: 開關(guān)
電路: 1 x SPDT - NC/NO
導(dǎo)通狀態(tài)電阻: 40 歐姆
電壓電源: 單/雙電源
電壓 - 電源,單路/雙路(±): 12V,±15V
電流 - 電源: 100pA
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 8-SOIC(0.154",3.90mm 寬)
供應(yīng)商設(shè)備封裝: 8-SO
包裝: 帶卷 (TR)
ADG419
Rev. B | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
TA= 25°C unless otherwise noted.
Table 3.
Parameter
Rating
VDD to VSS
44 V
VDD to GND
0.3 V to +25 V
VSS to GND
+0.3 V to 25 V
VL to GND
0.3 V to VDD + 0.3 V
VSS 2 V to VDD + 2 V
or 30 mA, whichever
occurs first
Continuous Current, S or D
30 mA
Peak Current, S or D (Pulsed at 1 ms,
10% Duty-Cycle Maximum)
100 mA
Operating Temperature Range
Industrial (B Version)
40°C to +125°C
Extended (T Version)
55°C to +125°C
Storage Temperature Range
65°C to +150°C
Junction Temperature
150°C
CERDIP Package, Power Dissipation
600 mW
θJA, Thermal Impedance
110°C/W
Lead Temperature, Soldering (10 sec)
300°C
PDIP Package, Power Dissipation
400 mW
θJA, Thermal Impedance
100°C/W
Lead Temperature, Soldering (10 sec)
260°C
SOIC Package, Power Dissipation
400 mW
θJA, Thermal Impedance
155°C/W
MSOP Package, Power Dissipation
315 mW
θJA, Thermal Impedance
205°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec)
215°C
Infrared (15 sec)
220°C
1Overvoltages at IN, S or D is clamped by internal diodes. Limit current to the
maximum ratings given.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
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