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ADG419
Rev. B | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
TA= 25°C unless otherwise noted.
Table 3.
Parameter
Rating
VDD to VSS
44 V
VDD to GND
0.3 V to +25 V
VSS to GND
+0.3 V to 25 V
VL to GND
0.3 V to VDD + 0.3 V
VSS 2 V to VDD + 2 V
or 30 mA, whichever
occurs first
Continuous Current, S or D
30 mA
Peak Current, S or D (Pulsed at 1 ms,
10% Duty-Cycle Maximum)
100 mA
Operating Temperature Range
Industrial (B Version)
40°C to +125°C
Extended (T Version)
55°C to +125°C
Storage Temperature Range
65°C to +150°C
Junction Temperature
150°C
CERDIP Package, Power Dissipation
600 mW
θJA, Thermal Impedance
110°C/W
Lead Temperature, Soldering (10 sec)
300°C
PDIP Package, Power Dissipation
400 mW
θJA, Thermal Impedance
100°C/W
Lead Temperature, Soldering (10 sec)
260°C
SOIC Package, Power Dissipation
400 mW
θJA, Thermal Impedance
155°C/W
MSOP Package, Power Dissipation
315 mW
θJA, Thermal Impedance
205°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec)
215°C
Infrared (15 sec)
220°C
1Overvoltages at IN, S or D is clamped by internal diodes. Limit current to the
maximum ratings given.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION