ADG621/ADG622/ADG623
Rev. B | Page 5 of 12
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Parameter
Rating
V
DD to VSS
13 V
V
DD to GND
0.3 V to +6.5 V
V
SS to GND
+0.3 V to –6.5 V
V
SS – 0.3 V to VDD + 0.3 V
–0.3 V to V
DD + 0.3 V or 30 mA,
whichever occurs first
Peak Current, S or D
100 mA (pulsed at 1 ms,
10% duty cycle maximum)
Continuous Current, S or D
50 mA
Operating Temperature Range
Industrial (B Version)
–40°C to +85°C
Storage Temperature Range
–65°C to +150°C
Junction Temperature
150°C
MSOP Package
θ
JA Thermal Impedance
206°C/W
θ
JC Thermal Impedance
44°C/W
Lead Soldering
Lead Temperature, Soldering
(10 sec)
300°C
IR Reflow, Peak Temperature
220°C
Pb-Free Soldering
Reflow, Peak Temperature
260(+0/5)°C
Time at Peak Temperature
20 sec to 40 sec
1 Overvoltages at INx, S, or D must be clamped by internal diodes. Currents
should be limited to the maximum ratings given.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one absolute maximum rating may be applied at any
one time.
Table 4. ADG621/ADG622 Truth Table
ADG621 INx
ADG622 INx
Switch Sx Condition
0
1
Off
1
0
On
Table 5. ADG623 Truth Table
IN1
IN2
Switch S1
Switch S2
0
Off
On
0
1
Off
1
0
On
1
On
Off
ESD CAUTION