- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄373991 > ADG758BCP (ANALOG DEVICES INC) 3 ohm, 4-/8-Channel Multiplexers in Chip Scale Package PDF資料下載
參數(shù)資料
| 型號： | ADG758BCP |
| 廠商： | ANALOG DEVICES INC |
| 元件分類： | 運動控制電子 |
| 英文描述： | 3 ohm, 4-/8-Channel Multiplexers in Chip Scale Package |
| 中文描述： | 8-CHANNEL, SGL ENDED MULTIPLEXER, QCC20 |
| 封裝： | 4 X 4 MM, CSP-20 |
| 文件頁數(shù)： | 5/12頁 |
| 文件大小： | 308K |
| 代理商： | ADG758BCP |
ADG758/ADG759
–5–
REV. A
ABSOLUTE MAXIMUM RATINGS
1
(T
A
= 25
°
C, unless otherwise noted.)
V
DD
to V
SS
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
V
DD
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
V
SS
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –3.5 V
Analog Inputs
2
. . . . . . . . . . . . . . V
SS
– 0.3 V to V
DD
+0.3 V or
30 mA, Whichever Occurs First
Digital Inputs
2
. . . . . . . . . . . . . . . . . . –0.3 V to V
DD
+0.3 V or
30 mA, Whichever Occurs First
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA
(Pulsed at 1 ms, 10% Duty Cycle max)
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 30 mA
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . –40
°
C to +85
°
C
Storage Temperature Range . . . . . . . . . . . . –65
°
C to +150
°
C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150
°
C
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the ADG758/ADG759 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
Chip Scale Package,
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 32
°
C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . . 215
°
C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220
°
C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
2
Overvoltages at EN, A, S, or D will be clamped by internal diodes. Current should
be limited to the maximum ratings given.
Table I. ADG758 Truth Table
A2
A1
A0
EN
Switch Condition
X
0
0
0
0
1
1
1
1
X
0
0
1
1
0
0
1
1
X
0
1
0
1
0
1
0
1
0
1
1
1
1
1
1
1
1
NONE
1
2
3
4
5
6
7
8
X = Don’t Care
Table II. ADG759 Truth Table
A1
A0
EN
ON Switch Pair
X
0
0
1
1
X
0
1
0
1
0
1
1
1
1
NONE
1
2
3
4
X = Don’t Care
ORDERING GUIDE
Model
Temperature Range
–40
°
C to +85
°
C
–40
°
C to +85
°
C
Package Description
Package Option
ADG758BCP
ADG759BCP
20-Lead Chip Scale Package (CSP)
20-Lead Chip Scale Package (CSP)
CP-20
CP-20
PIN CONFIGURATIONS
TOP VIEW
(Not to Scale)
PIN 1
EN
V
SS
S1
S2
S3
GND
V
DD
S5
S6
S7
ADG758
N
20
A
19
A
18
A
17
N
16
S
D
N
N
S
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
NC = NO CONNECT
EXPOSED PAD TIED TO SUBSTRATE, V
SS
TOP VIEW
(Not to Scale)
PIN 1
EN
S1A
S2A
S3A
GND
V
DD
S1B
S2B
S3B
ADG759
N
20
A
19
N
18
A
17
N
16
S
D
N
D
S
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
NC = NO CONNECT
EXPOSED PAD TIED TO SUBSTRATE, V
SS
V
SS
相關PDF資料 |
PDF描述 |
|---|---|
| ADG759 | 3 ohm, 4-/8-Channel Multiplexers in Chip Scale Package |
| ADG759BCP | 3 ohm, 4-/8-Channel Multiplexers in Chip Scale Package |
| ADG774A | Low Voltage 400 MHz Quad 2:1 Mux with 3 ns Switching Time |
| ADG774 | CMOS 3 V/5 V, Wide Bandwidth Quad 2:1 Mux |
| ADG774BR | CMOS 3 V/5 V, Wide Bandwidth Quad 2:1 Mux |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| ADG758BCP-REEL | 制造商:Analog Devices 功能描述:Analog Multiplexer Single 8:1 20-Pin LFCSP EP T/R 制造商:Rochester Electronics LLC 功能描述:8 CHNL MUX I.C. - Tape and Reel |
| ADG758BCP-REEL7 | 制造商:Analog Devices 功能描述:Analog Multiplexer Single 8:1 20-Pin LFCSP EP T/R |
| ADG758BCPZ | 功能描述:IC MULTIPLEXER 8X1 20LFCSP RoHS:是 類別:集成電路 (IC) >> 接口 - 模擬開關，多路復用器，多路分解器 系列:- 特色產(chǎn)品:MicroPak? 標準包裝:1 系列:- 功能:開關 電路:2 x SPST - NC 導通狀態(tài)電阻:500 毫歐 電壓電源:單電源 電壓 - 電源，單路/雙路(±):1.4 V ~ 4.3 V 電流 - 電源:150nA 工作溫度:-40°C ~ 125°C 安裝類型:表面貼裝 封裝/外殼:8-XFDFN 供應商設備封裝:8-XSON，SOT833-1 （1.95x1） 包裝:Digi-Reel® 其它名稱:568-5557-6 |
| ADG758BCPZ | 制造商:Analog Devices 功能描述:IC, ANALOG MULTIPLEXER, 8 X 1, LFCSP-20 |
| ADG758BCPZ-REEL7 | 功能描述:IC MULTIPLEXER 8X1 20LFCSP RoHS:是 類別:集成電路 (IC) >> 接口 - 模擬開關，多路復用器，多路分解器 系列:- 標準包裝:1,000 系列:- 功能:多路復用器 電路:1 x 4:1 導通狀態(tài)電阻:- 電壓電源:雙電源 電壓 - 電源，單路/雙路(±):±5V 電流 - 電源:7mA 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:16-SOIC（0.154"，3.90mm 寬） 供應商設備封裝:16-SOIC 包裝:帶卷 (TR) |
發(fā)布緊急采購，3分鐘左右您將得到回復。