參數(shù)資料
型號(hào): ADG781
廠商: Analog Devices, Inc.
英文描述: 2.5 ohm Quad SPST Switches in Chip Scale Package
中文描述: 2.5歐姆四路SPST開(kāi)關(guān),在芯片級(jí)封裝
文件頁(yè)數(shù): 4/8頁(yè)
文件大?。?/td> 169K
代理商: ADG781
REV. A
ADG781/ADG782/ADG783
–4–
ABSOLUTE MAXIMUM RATINGS
1
(T
A
= 25
°
C unless otherwise noted.)
V
DD
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +6 V
Analog, Digital Inputs
2
. . . . . . . . . . –0.3 V to V
DD
+ 0.3 V or
30 mA, Whichever Occurs First
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 30 mA
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA
(Pulsed at 1 ms, 10% Duty Cycle max)
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . –40
°
C to +85
°
C
Storage Temperature Range . . . . . . . . . . . . –65
°
C to +150
°
C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . 150
°
C
Chip Scale Package
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 32
°
C/W
ORDERING GUIDE
Model
Temperature Range
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
Package Description
Package Option
ADG781BCP
ADG782BCP
ADG783BCP
20-Lead Chip Scale (CSP)
20-Lead Chip Scale (CSP)
20-Lead Chip Scale (CSP)
CP-20
CP-20
CP-20
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . . 300
°
C
IR Reflow (<20 sec) . . . . . . . . . . . . . . . . . . . . . . . . . 235
°
C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
2
Overvoltages at IN, S, or D will be clamped by internal diodes. Current should be
limited to the maximum ratings given.
PIN CONFIGURATION
(CSP)
TOP VIEW
(Not to Scale)
PIN 1
D1
S1
GND
S4
D4
D2
S2
V
DD
S3
D3
ADG781/ADG782/
ADG783
N
20
I
19
N
18
I
17
N
16
N
I
N
I
N
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
NC = NO CONNECT
EXPOSED PAD TIED TO SUBSTRATE, GND
Table I. Truth Table (ADG781/ADG782)
ADG781 In
ADG782 In
Switch Condition
0
1
1
0
ON
OFF
Table II. Truth Table (ADG783)
Logic
Switch 1, 4
Switch 2, 3
0
1
OFF
ON
ON
OFF
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the ADG781/ADG782/ADG783 feature proprietary ESD protection circuitry, permanent
damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper
ESD precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
相關(guān)PDF資料
PDF描述
ADG781BCP 2.5 ohm Quad SPST Switches in Chip Scale Package
ADG782 2.5 ohm Quad SPST Switches in Chip Scale Package
ADG782BCP 2.5 ohm Quad SPST Switches in Chip Scale Package
ADG783 2.5 ohm Quad SPST Switches in Chip Scale Package
ADG783BCP 2.5 ohm Quad SPST Switches in Chip Scale Package
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