參數(shù)資料
型號(hào): ADM00375
廠商: Microchip Technology
文件頁(yè)數(shù): 7/46頁(yè)
文件大?。?/td> 0K
描述: BOARD EVAL FOR MCP6H04 OP AMP
設(shè)計(jì)資源: MCP6H04 BOM
MCP6H04 Schematics
MCP6H04 Gerber File
標(biāo)準(zhǔn)包裝: 1
每 IC 通道數(shù): 4 - 四
放大器類型: 通用
輸出類型: 滿擺幅
轉(zhuǎn)換速率: 0.8 V/µs
電流 - 輸出 / 通道: 50mA
工作溫度: -40°C ~ 125°C
電流供應(yīng)(主 IC): 135µA
電壓 - 電源,單路/雙路(±): 3.5 V ~ 16 V,±1.75 V ~ 8 V
板類型: 完全填充
已供物品:
已用 IC / 零件: MCP6H04
2010-2011 Microchip Technology Inc.
DS22243D-page 15
MCP6H01/2/4
3.0
PIN DESCRIPTIONS
Descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
3.1
Analog Outputs
The output pins are low-impedance voltage sources.
3.2
Analog Inputs
The
non-inverting
and
inverting
inputs
are
high-impedance CMOS inputs with low bias currents.
3.3
Power Supply Pins
The positive power supply (VDD) is 3.5V to 16V higher
than the negative power supply (VSS). For normal
operation, the other pins are at voltages between VSS
and VDD.
Typically, these parts can be used in single-supply
operation or dual-supply operation. Also, VDD will need
bypass capacitors.
3.4
Exposed Thermal Pad (EP)
There is an internal electrical connection between the
Exposed Thermal Pad (EP) and the VSS pin; they must
be connected to the same potential on the Printed
Circuit Board (PCB).
MCP6H01
MCP6H02
MCP6H04
Symbol
Description
SC70-5,
SOT-23-5
SOIC
2x3 TDFNSOIC2x3 TDFN
SOIC,
TSSOP
166
1
VOUT, VOUTA Analog Output (op amp A)
422
2
VIN–, VINA
Inverting Input (op amp A)
333
3
VIN+, VINA+
Non-inverting Input (op amp A)
577
8
4
VDD
Positive Power Supply
——
5
VINB+
Non-inverting Input (op amp B)
——
6
VINB
Inverting Input (op amp B)
——
7
VOUTB
Analog Output (op amp B)
———
8
VOUTC
Analog Output (op amp C)
———
9
VINC
Inverting Input (op amp C)
———
10
VINC+
Non-inverting Input (op amp C)
244
4
11
VSS
Negative Power Supply
———
12
VIND+
Non-inverting Input (op amp D)
———
13
VIND
Inverting Input (op amp D)
———
14
VOUTD
Analog Output (op amp D)
1, 5, 8
NC
No Internal Connection
9
9
EP
Exposed Thermal Pad (EP); must
be connected to VSS.
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