TA = 25°C, unless o" />
參數(shù)資料
型號: ADM206ARS
廠商: Analog Devices Inc
文件頁數(shù): 11/16頁
文件大小: 0K
描述: IC TXRX RS-232 5V SD/EN 24SSOP
標準包裝: 59
類型: 收發(fā)器
驅(qū)動器/接收器數(shù): 4/4
規(guī)程: RS232
電源電壓: 4.5 V ~ 5.5 V
安裝類型: 表面貼裝
封裝/外殼: 24-SSOP(0.209",5.30mm 寬)
供應商設備封裝: 24-SSOP
包裝: 管件
ADM206–ADM211/ADM213
Rev. C | Page 4 of 16
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Parameter
Min
VCC
–0.3 V to +6 V
V+
(VCC – 0.3 V) to +14 V
V–
+0.3 V to –14 V
Input Voltages
TIN
–0.3 V to (VCC + 0.3 V)
RIN
±30 V
Output Voltages
TOUT
(V+, +0.3 V) to (V–, –0.3 V)
ROUT
–0.3 V to (VCC + 0.3 V)
Short-Circuit Duration
TOUT
Continuous
Power Dissipation
N-24 PDIP (Derate 13.5 mW/°C
above 70°C)
1000 mW
R-24 SOIC (Derate 12 mW/°C
above 70°C)
850 mW
R-28 SOIC (Derate 12.5 mW/°C
above 70°C)
900 mW
RS-24 SSOP (Derate 12 mW/°C
above 70°C)
850 mW
RS-28 SSOP (Derate 10 mW/°C
above 70°C)
900 mW
Thermal Impedance, θJA
N-24 PDIP
120°C/W
R-24 SOIC
85°C/W
R-28 SOIC
80°C/W
RS-24 SSOP
115°C/W
RS-28 SSOP
100°C/W
Operating Temperature Range
Industrial (A Version)
–40°C to +85°C
Storage Temperature Range
–65°C to +150°C
Lead Temperature, Soldering
300°C
Vapor Phase (60 s)
215°C
Infrared (15 s)
220°
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to
absolute maximum rating conditions for extended periods of
time may affect device reliability.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the
human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
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