REV. 0
–2–
ADM2209E–SPECIFICATIONS
(VDD = 10.8 V to 13.2 V, VSTBY = 3.3 V
5% or 5 V
10%, C1 = C2 = 0.1
F. All
specifications TMIN to TMAX unless otherwise noted.)
Parameter
Min
Typ1 Max
Units
Test Conditions/Comments
OPERATING CONDITIONS
Operating Voltage Range, VDD
+10.8 +12 +13.2 V
Standby Voltage Range, VSTBY
+3.15
+5.5
V
VDD Power Supply Current
2
5
mA
No Load, All Driver Inputs at 0.8 V or 2 V,
All Receiver Inputs at +15 V or –15 V
VSTBY Supply Current
100
200
A
No Load, All Tx IN at VSTBY or Open
TRANSMITTER (DRIVER) CMOS INPUTS
Input Pull-Up Current
10
25
A
Transmitter Input at GND
High Level Input Voltage, VINH
2.1
V
Low Level Input Voltage, VINL
0.4
V
TRANSMITTER (DRIVER) EIA-232 OUTPUTS
Output Voltage Swing
±5.0 ±9.0
V
All Transmitter Outputs Loaded with 3 k
to GND
Output Short-Circuit Current, IOS
±5
±15 ±30
mA
VO = 0 V, VIN = 0.8 V
3
Output Resistance
300
VDD = 0 V, VSTBY = 0 V, VIN =
±2 V
RECEIVER EIA-232 INPUTS
Input Voltage Range
–15
+15
V
Input Low Threshold, VTL
0.4
1.45
V
Input High Threshold, VTH
1.7
2.4
V
Input Hysteresis
0.25
V
Input Resistance, RIN
35
7
k
VIN =
±15 V
RECEIVER OUTPUTS
4
High Level Output Voltage, VOH
2.4
V
IOH = –40
A
Low Level Output Voltage, VOL
0.2
0.4
V
IOL = +1.6 mA
Output Leakage Current (Except R5A, R5B)
0.05
±5
AV
DD = 0 V
DRIVER SWITCHING CHARACTERISTICS
5
Maximum Data Rate
460
kbps
RL = 3 k to 7 k, CL = 50 pF to 470 pF
460
kbps
RL = 3 k
to 7 k, C
L = 50 pF to 1000 pF,
TA = 0
°C to +85°C, 5 V ± 10% Only
920
kbps
RL = 3 k
to 7 k, C
L = 50 pF to 470 pF,
VSTBY = 5 V
± 5%, V
DD = 12 V
± 5%
Propagation Delay, High to Low, TPHL
1
sR
L = 3 k, CL = 1000 pF (Figures 1 and 2)
Propagation Delay, Low to High, TPLH
1
sR
L = 3 k
, C
L = 1000 pF (Figures 1 and 2)
Transition Region Slew Rate
6
16
V/
sR
L = 3 k
to 7 k, C
L = 50 pF to 470 pF
Transition Region Slew Rate (5 V)
4
16
V/
sR
L = 3 k
to 7 k, C
L = 50 pF to 1000 pF,
VSTBY = 5 V
± 10% Only. Measured from +3 V
to –3 V or Vice Versa
RECEIVER SWITCHING CHARACTERISTICS
Maximum Data Rate
920
kbps
CL = 150 pF, VSTBY = 5 V ± 5% Only
460
kbps
CL = 150 pF
Propagation Delay, R1–R4
0.4
0.75
sC
L = 150 pF
Propagation Delay, R5
1
2
sC
L = 150 pF
Output Rise Time, tr
30
ns
Figures 3 and 4
Output Fall Time, tf
30
ns
ESD AND EMC
ESD Protection (I-O Pins)
±15
kV
Human Body Model
±15
kV
IEC1000-4-2 Air Discharge
±8
kV
IEC1000-4-2 Contact Discharge
ESD Protection (All Other Pins)
±2.5
kV
Human Body Model, MIL-STD-883B
EFT Protection (I-O Pins)
±2
kV
IEC1000-4-4
EMI Immunity
10
V/m
IEC1000-4-3
NOTES
1All typicals are given for V
DD = +12 V, VSTBY = 5 V, TA = +25
°C.
2Current into device pins is defined as positive. Current out-of-device pins is defined as negative. All voltages are referred to ground unless otherwise specified. For
current, minimum and maximum values are specified as an absolute value and the sign is used to indicate direction. For voltage logic levels, the more positive value is
designated as maximum. For example, if –6 V is a maximum, the typical value (–6.8 V) is more negative.
3Only one driver output shorted at a time.
4If receiver inputs are unconnected, receiver output is a logic high.
5Refer to typical curves. Driver output slew rate is measured from the +3.0 V to the –3.0 V level on the output waveform. Slew rate is determined by load capacitance.
Specifications subject to change without notice.