ADM231L–ADM234L/ADM236L–ADM241L
Rev. C | Page 4 of 20
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Parameter
Rating
VCC
–0.3 V to +6 V
V+
(VCC – 0.3 V) to +14 V
V–
+0.3 V to 14 V
Input Voltages
TIN
–0.3 V to (VCC + 0.3 V)
RIN
±30 V
Output Voltages
TOUT
(V+, +0.3 V) to (V–, –0.3 V)
ROUT
–0.3 V to (VCC + 0.3 V)
Short-Circuit Duration
TOUT
Continuous
Power Dissipation
N-14 PDIP (Derate 10 mW/°C
above 70°C)
800 mW
N-16 PDIP (Derate 10.5 mW/°C
above 70°C)
840 mW
N-20 PDIP (Derate 11 mW/°C
above 70°C)
890 mW
N-24-1 PDIP (Derate
13.5 mW/°C above 70°C)
1000 mW
R-16 SOIC (Derate 9 mW/°C
above 70°C)
760 mW
R-24 SOIC (Derate 12 mW/°C
above 70°C)
850 mW
R-28 SOIC (Derate 12.5 mW/°C
above 70°C)
900 mW
RS-28 SSOP (Derate 10 mW/°C
above 70°C)
900 mW
Parameter
Rating
Q-14 CERDIP (Derate 10 mW/°C
above 70°C)
720 mW
Q-16 CERDIP (Derate 10 mW/°C
above 70C)
800 mW
Q-24 CERDIP (Derate
12.5 mW/°C above 70°C)
1000 mW
Thermal Impedance, θJA
N-14 PDIP
140°C/W
N-16 PDIP
135°C/W
N-20 PDIP
125°C/W
N-24-1 PDIP
120°C/W
R-16 SOIC
105°C/W
R-24 SOIC
85°C/W
R-28 SOIC
80°C/W
RS-28 SSOP
100°C/W
Q-14 CERDIP
105°C/W
Q-16 CERDIP
100°C/W
Q-24 CERDIP
55°C/W
Operating Temperature Range
Commercial (J Version)
0°C to 70°C
Industrial (A Version)
40°C to +85°C
Storage Temperature Range
65°C to +150°C
Lead Temperature, Soldering
300°C
Vapor Phase (60 sec)
215°C
Infrared (15 sec)
220° C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at these or
any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to
absolute maximum rating conditions for extended periods of
time may affect device reliability.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.