參數(shù)資料
型號(hào): ADM237LANZ
廠商: Analog Devices Inc
文件頁(yè)數(shù): 8/20頁(yè)
文件大小: 0K
描述: IC TXRX RS-232 5:3 5V LP 24DIP
標(biāo)準(zhǔn)包裝: 15
類(lèi)型: 收發(fā)器
驅(qū)動(dòng)器/接收器數(shù): 4/3
規(guī)程: RS232
電源電壓: 4.75 V ~ 5.25 V
安裝類(lèi)型: 通孔
封裝/外殼: 24-DIP(0.300",7.62mm)
供應(yīng)商設(shè)備封裝: 24-PDIP
包裝: 管件
ADM231L–ADM234L/ADM236L–ADM241L
Rev. C | Page 16 of 20
1.290 (32.77)
1.150 (31.57)
0.580 (14.73)
0.485 (12.32)
0.165 (4.19)
0.160 (4.06)
0.155 (3.93)
0.015 (0.38)
0.010 (0.25)
0.008 (0.20)
0.610 (15.49)
0.600 (15.24)
0.590 (14.99)
0.015 (0.38) MIN
0.210 (5.34)
MAX
SEATING
PLANE
0.022 (0.56)
0.018 (0.46)
0.014 (0.36)
0.100
(2.54)
BSC
0.070 (1.78)
0.030 (0.76)
0.200 (5.08)
0.115 (2.92)
24
1
12
13
PIN 1
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
COMPLIANT TO JEDEC STANDARDS MS-011-AA
Figure 42. 24-Lead Plastic Dual In-Line Package [PDIP]
Wide Body (N-24-2)
Dimensions shown in inches and (millimeters)
24
11
2
13
0.310 (7.87)
0.220 (5.59)
PIN 1
0.005 (0.13)
MIN
0.098 (2.49)
MAX
15°
0.320 (8.13)
0.290 (7.37)
0.015 (0.38)
0.008 (0.20)
SEATING
PLANE
0.200 (5.08)
MAX
1.280 (32.51) MAX
0.150 (3.81)
MIN
0.200 (5.08)
0.125 (3.18)
0.023 (0.58)
0.014 (0.36)
0.100
(2.54)
BSC
0.070 (1.78)
0.030 (0.76)
0.060 (1.52)
0.015 (0.38)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
Figure 43. 24-Lead Ceramic Dual in-Line Package [CERDIP]
(Q-24)
Dimensions shown in inches and (millimeters)
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
COMPLIANT TO JEDEC STANDARDS MS-013AD
0.75 (0.0295)
0.25 (0.0098)
× 45°
1.27 (0.0500)
0.40 (0.0157)
0.33 (0.0130)
0.20 (0.0079)
SEATING
PLANE
0.30 (0.0118)
0.10 (0.0039)
0.51 (0.020)
0.31 (0.012)
2.65 (0.1043)
2.35 (0.0925)
1.27 (0.0500)
BSC
24
13
12
1
10.65 (0.4193)
10.00 (0.3937)
7.60 (0.2992)
7.40 (0.2913)
15.60 (0.6142)
15.20 (0.5984)
COPLANARITY
0.10
Figure 44. 24-Lead Standard Small Outline Package [SOIC]
Wide Body (R-24)
Dimensions shown in millimeters and (inches)
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
COMPLIANT TO JEDEC STANDARDS MS-013AE
0.33 (0.0130)
0.20 (0.0079)
0.75 (0.0295)
0.25 (0.0098)
× 45°
1.27 (0.0500)
0.40 (0.0157)
SEATING
PLANE
0.30 (0.0118)
0.10 (0.0039)
0.51 (0.0201)
0.33 (0.0130)
2.65 (0.1043)
2.35 (0.0925)
1.27 (0.0500)
BSC
28
15
14
1
18.10 (0.7126)
17.70 (0.6969)
10.65 (0.4193)
10.00 (0.3937)
7.60 (0.2992)
7.40 (0.2913)
COPLANARITY
0.10
Figure 45. 28-Lead Standard Small Outline Package [SOIC]
Wide Body (R-28)
Dimensions shown in millimeters and (inches)
0.25
0.09
0.95
0.75
0.55
0.05 MIN
1.85
1.75
1.65
2.00 MAX
0.38
0.22
SEATING
PLANE
0.65
BSC
COPLANARITY
0.10
28
15
14
1
10.50
10.20
9.90
5.60
5.30
5.00
8.20
7.80
7.40
PIN 1
COMPLIANT TO JEDEC STANDARDS MO-150AH
Figure 46. 28-Lead Shrink Small Outline Package [SSOP]
(RS-28)
Dimensions shown in millimeters
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