參數(shù)資料
型號： ADM241LARZ-REEL
廠商： Analog Devices Inc
文件頁數(shù)： 7/20頁
文件大?。?/td> 0K
描述： IC TXRX RS-232 4:5 5V LP 28SSOP
標(biāo)準(zhǔn)包裝： 1,000
類型： 收發(fā)器
驅(qū)動器/接收器數(shù)： 4/5
規(guī)程： RS232
電源電壓： 4.75 V ~ 5.25 V
安裝類型： 表面貼裝
封裝/外殼： 28-SSOP（0.209"，5.30mm 寬）
供應(yīng)商設(shè)備封裝： 28-SSOP
包裝： 帶卷 (TR)
ADM231L–ADM234L/ADM236L–ADM241L
Rev. C | Page 15 of 20
16
18
9
0.310 (7.87)
0.220 (5.59)
PIN 1
0.005
(0.13)
MIN
0.098 (2.49)
MAX
15°
0°
0.320 (8.13)
0.290 (7.37)
0.015 (0.38)
0.008 (0.20)
SEATING
PLANE
0.200 (5.08)
MAX
0.840 (21.34) MAX
0.150 (3.81)
MIN
0.200 (5.08)
0.125 (3.18)
0.023 (0.58)
0.014 (0.36)
0.100
(2.54)
BSC
0.070 (1.78)
0.030 (0.76)
0.060 (1.52)
0.015 (0.38)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
Figure 36. 16-Lead Ceramic Dual In-Line Package [CERDIP]
(Q-16)
Dimensions shown in inches and (millimeters)
20
1
10
11
0.985 (25.02)
0.965 (24.51)
0.945 (24.00)
0.295 (7.49)
0.285 (7.24)
0.275 (6.99)
0.015 (0.38)
0.010 (0.25)
0.008 (0.20)
0.325 (8.26)
0.310 (7.87)
0.300 (7.62)
SEATING
PLANE
0.015 (0.38) MIN
0.180 (4.57)
MAX
0.022 (0.56)
0.018 (0.46)
0.014 (0.36)
0.150 (3.81)
0.130 (3.30)
0.110 (2.79)
0.100
(2.54)
BSC
0.060 (1.52)
0.050 (1.27)
0.045 (1.14)
0.150 (3.81)
0.135 (3.43)
0.120 (3.05)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
COMPLIANT TO JEDEC STANDARDS MO-095-AE
Figure 37. 20-Lead Plastic Dual In-Line Package [PDIP]
(N-20)
Dimensions shown in inches and (millimeters)
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
COMPLIANT TO JEDEC STANDARDS MS-013AC
0.75 (0.0295)
0.25 (0.0098)
20
11
10
1
8°
0°
× 45°
1.27 (0.0500)
0.40 (0.0157)
SEATING
PLANE
0.30 (0.0118)
0.10 (0.0039)
0.51 (0.0201)
0.31 (0.0122)
2.65 (0.1043)
2.35 (0.0925)
0.33 (0.0130)
0.20 (0.0079)
1.27
(0.0500)
BSC
10.65 (0.4193)
10.00 (0.3937)
7.60 (0.2992)
7.40 (0.2913)
13.00 (0.5118)
12.60 (0.4961)
COPLANARITY
0.10
Figure 38. 20-Lead Standard Small Outline Package [SOIC]
Wide Body (R-20)
Dimensions shown in millimeters and (inches)
20
110
11
0.310 (7.87)
0.220 (5.59)
PIN 1
0.005
(0.13)
MIN
0.098 (2.49)
MAX
15°
0°
0.320 (8.13)
0.290 (7.37)
0.015 (0.38)
0.008 (0.20)
SEATING
PLANE
0.200 (5.08)
MAX
1.060 (26.92) MAX
0.150 (3.81)
MIN
0.200 (5.08)
0.125 (3.18)
0.023 (0.58)
0.014 (0.36)
0.100
(2.54)
BSC
0.070 (1.78)
0.030 (0.76)
0.060 (1.52)
0.015 (0.38)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
Figure 39. 20-Lead Ceramic Dual In-Line Package [CERDIP]
(Q-20)
Dimensions shown in inches and (millimeters)
24
112
13
1.185 (30.01)
1.165 (29.59)
1.145 (29.08)
0.295 (7.49)
0.285 (7.24)
0.275 (6.99)
0.150 (3.81)
0.135 (3.43)
0.120 (3.05)
0.015 (0.38)
0.010 (0.25)
0.008 (0.20)
0.325 (8.26)
0.310 (7.87)
0.300 (7.62)
SEATING
PLANE
0.015 (0.38) MIN
0.180
(4.57)
MAX
0.022 (0.56)
0.018 (0.46)
0.014 (0.36)
0.150 (3.81)
0.130 (3.30)
0.110 (2.79)
0.100
(2.54)
BSC
0.060 (1.52)
0.050 (1.27)
0.045 (1.14)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
COMPLIANT TO JEDEC STANDARDS MO-095AG
Figure 40. 24-Lead Plastic Dual In-Line Package [PDIP]
(N-24-1)
Dimensions shown in inches and (millimeters)
SEATING
PLANE
0.023 (0.58)
0.014 (0.36)
0.075 (1.91)
0.015 (0.38)
0.225 (5.72)
MAX
0.200 (5.08)
0.120 (3.05)
0.070 (1.78)
0.030 (0.76)
0.150
(3.81)
MIN
1.290 (32.77) MAX
0.100 (2.54)
BSC
24
2
1
13
0.610 (15.49)
0.500 (12.70)
PIN 1
0.098 (2.49) MAX
0.005 (0.13) MIN
0.620 (15.75)
0.590 (14.99)
0.015 (0.38)
0.008 (0.20)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
Figure 41. 24-Lead Side-Brazed Ceramic Dual In-Line Package [SBDIP]
(D-24-2)
Dimensions shown in inches and (millimeters)
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ADM241LJRS 功能描述:IC TXRX RS-232 4:5 5V LP 28SSOP RoHS:否 類別:集成電路 (IC) >> 接口 - 驅(qū)動器，接收器，收發(fā)器 系列:- 標(biāo)準(zhǔn)包裝:27 系列:- 類型:收發(fā)器 驅(qū)動器/接收器數(shù):3/3 規(guī)程:RS232，RS485 電源電壓:4.75 V ~ 5.25 V 安裝類型:表面貼裝 封裝/外殼:28-SOIC（0.295"，7.50mm 寬） 供應(yīng)商設(shè)備封裝:28-SOIC 包裝:管件
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ADM241LJRSZ 功能描述:IC TXRX RS-232 4:5 5V LP 28SSOP RoHS:是 類別:集成電路 (IC) >> 接口 - 驅(qū)動器，接收器，收發(fā)器 系列:- 標(biāo)準(zhǔn)包裝:121 系列:- 類型:收發(fā)器 驅(qū)動器/接收器數(shù):1/1 規(guī)程:RS422，RS485 電源電壓:3 V ~ 3.6 V 安裝類型:表面貼裝 封裝/外殼:10-WFDFN 裸露焊盤 供應(yīng)商設(shè)備封裝:10-DFN（3x3） 包裝:管件
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