參數(shù)資料
型號: ADM241LJRSZ-REEL
廠商: Analog Devices Inc
文件頁數(shù): 6/20頁
文件大?。?/td> 0K
描述: IC TXRX RS-232 4:5 5V LP 28SSOP
標(biāo)準(zhǔn)包裝: 1,500
類型: 收發(fā)器
驅(qū)動器/接收器數(shù): 4/5
規(guī)程: RS232
電源電壓: 4.75 V ~ 5.25 V
安裝類型: 表面貼裝
封裝/外殼: 28-SSOP(0.209",5.30mm 寬)
供應(yīng)商設(shè)備封裝: 28-SSOP
包裝: 帶卷 (TR)
ADM231L–ADM234L/ADM236L–ADM241L
Rev. C | Page 14 of 20
OUTLINE DIMENSIONS
14
17
8
0.685 (17.40)
0.665 (16.89)
0.645 (16.38)
0.295 (7.49)
0.285 (7.24)
0.275 (6.99)
0.100 (2.54)
BSC
SEATING
PLANE
0.180 (4.57)
MAX
0.022 (0.56)
0.018 (0.46)
0.014 (0.36)
0.150 (3.81)
0.130 (3.30)
0.110 (2.79)
0.060 (1.52)
0.050 (1.27)
0.045 (1.14)
0.015 (0.38)
0.010 (0.25)
0.008 (0.20)
0.325 (8.26)
0.310 (7.87)
0.300 (7.62)
0.015 (0.38)
MIN
0.150 (3.81)
0.135 (3.43)
0.120 (3.05)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
COMPLIANT TO JEDEC STANDARDS MO-095-AB
Figure 32. 14-Lead Plastic Dual In-Line Package [PDIP]
(N-14)
Dimensions shown in inches and (millimeters)
16
1
8
9
0.295 (7.49)
0.285 (7.24)
0.275 (6.99)
0.100 (2.54)
BSC
SEATING
PLANE
0.015 (0.38)
MIN
0.180 (4.57)
MAX
0.022 (0.56)
0.018 (0.46)
0.014 (0.36)
0.150 (3.81)
0.130 (3.30)
0.110 (2.79)
0.060 (1.52)
0.050 (1.27)
0.045 (1.14)
0.150 (3.81)
0.135 (3.43)
0.120 (3.05)
0.015 (0.38)
0.010 (0.25)
0.008 (0.20)
0.325 (8.26)
0.310 (7.87)
0.300 (7.62)
0.785 (19.94)
0.765 (19.43)
0.745 (18.92)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
COMPLIANT TO JEDEC STANDARDS MO-095AC
Figure 33. 16-Lead Plastic Dual In-Line Package [PDIP]
(N-16)
Dimensions shown in inches and (millimeters)
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
COMPLIANT TO JEDEC STANDARDS MS-013AA
SEATING
PLANE
0.30 (0.0118)
0.10 (0.0039)
0.51 (0.0201)
0.31 (0.0122)
2.65 (0.1043)
2.35 (0.0925)
1.27 (0.0500)
BSC
16
9
8
1
10.65 (0.4193)
10.00 (0.3937)
7.60 (0.2992)
7.40 (0.2913)
10.50 (0.4134)
10.10 (0.3976)
0.75 (0.0295)
0.25 (0.0098)
× 45°
1.27 (0.0500)
0.40 (0.0157)
0.33 (0.0130)
0.20 (0.0079)
COPLANARITY
0.10
Figure 34. 16-Lead Standard Small Outline Package [SOIC]
Wide Body (R-16)
Dimensions shown in millimeters and (inches)
14
17
8
0.310 (7.87)
0.220 (5.59)
PIN 1
0.005 (0.13) MIN
0.098 (2.49) MAX
0.100 (2.54) BSC
15°
0.320 (8.13)
0.290 (7.37)
0.015 (0.38)
0.008 (0.20)
SEATING
PLANE
0.200 (5.08)
MAX
0.785 (19.94) MAX
0.150
(3.81)
MIN
0.200 (5.08)
0.125 (3.18)
0.023 (0.58)
0.014 (0.36)
0.070 (1.78)
0.030 (0.76)
0.060 (1.52)
0.015 (0.38)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
Figure 35. 14-Lead Ceramic Dual In-Line Package [CERDIP]
(Q-14)
Dimensions shown in inches and (millimeters)
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