參數(shù)資料
型號(hào): ADM560JRSZ-REEL
廠商: Analog Devices Inc
文件頁數(shù): 12/12頁
文件大小: 0K
描述: IC TXRX RS232 4:5 3.3V LP 28SSOP
標(biāo)準(zhǔn)包裝: 1,500
類型: 收發(fā)器
驅(qū)動(dòng)器/接收器數(shù): 4/5
規(guī)程: RS232
電源電壓: 3 V ~ 3.6 V
安裝類型: 表面貼裝
封裝/外殼: 28-SSOP(0.209",5.30mm 寬)
供應(yīng)商設(shè)備封裝: 28-SSOP
包裝: 帶卷 (TR)
ADM560/ADM561
Rev. B | Page 9 of 12
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-150-AH
0601
06
-A
28
15
14
1
10.50
10.20
9.90
8.20
7.80
7.40
5.60
5.30
5.00
SEATING
PLANE
0.05 MIN
0.65 BSC
2.00 MAX
0.38
0.22
COPLANARITY
0.10
1.85
1.75
1.65
0.25
0.09
0.95
0.75
0.55
Figure 13. 28-Lead Shrink Small Outline Package [SSOP]
(RS-28)
Dimensions shown in millimeters
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
COMPLIANT TO JEDEC STANDARDS MS-013-AE
18.10 (0.7126)
17.70 (0.6969)
0.30 (0.0118)
0.10 (0.0039)
2.65 (0.1043)
2.35 (0.0925)
10.65 (0.4193)
10.00 (0.3937)
7.60 (0.2992)
7.40 (0.2913)
0.75 (0.0295)
0.25 (0.0098)
45°
1.27 (0.0500)
0.40 (0.0157)
COPLANARITY
0.10
0.33 (0.0130)
0.20 (0.0079)
0.51 (0.0201)
0.31 (0.0122)
SEATING
PLANE
28
15
14
1
1.27 (0.0500)
BSC
06
07
0
6-
A
Figure 14. 28-Lead Standard Small Outline Package [SOIC_W]
Wide Body
(RW-28)
Dimensions shown in millimeters and (inches)
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