參數(shù)資料
型號: ADN8102ACPZ
廠商: Analog Devices Inc
文件頁數(shù): 12/36頁
文件大小: 0K
描述: IC EQUALIZER 4CH XSTREAM 64LFCSP
標準包裝: 1
系列: XStream™
應(yīng)用: 以太網(wǎng)控制器
接口: I²C
電源電壓: 1.8 V ~ 3.3 V
封裝/外殼: 64-VFQFN 裸露焊盤,CSP
供應(yīng)商設(shè)備封裝: 64-LFCSP-VQ(9x9)
包裝: 托盤
安裝類型: 表面貼裝
ADN8102
Rev. B | Page 2 of 36
TABLE OF CONTENTS
REVISION HISTORY
10/10—Rev. A to Rev. B
Changes to Power Supply/Supply Current Parameter, Table 1... 4
Added tRESET Parameter and Note 1, Table 2 and Figure 3;
Renumbered Sequentially................................................................ 5
Added Junction Temperature Parameter, Table 3 ........................ 6
Changes to Introduction Section.................................................. 16
Added Table 5; Renumbered Sequentially .................................. 16
Changes to Equalization Settings Section ................................... 17
Added Table 7 and Advanced Equalization Settings Section ... 17
Changes to Table 8.......................................................................... 18
Added Table 12 ............................................................................... 20
Changes to Loopback Section and Changes to Table 13 ........... 20
Added Table 14 ............................................................................... 21
Changes to Table 15........................................................................ 21
Changes to Table 17........................................................................ 22
Deleted High Current Setting and Output Level Shift
Section.............................................................................................. 23
Deleted Table 14; Renumbered Sequentially .............................. 24
Changes to Table 18........................................................................ 24
Added Table 19 ............................................................................... 24
Deleted Table 15.............................................................................. 25
Added Applications Information Section and Output
Compliance Section ....................................................................... 27
Moved TxHeadroom and Figure 44............................................. 27
Changes to TxHeadroom and Figure 44 ..................................... 27
Added Table 20 ............................................................................... 27
Added Table 21 ............................................................................... 28
Deleted Transmission Lines Section and Soldering Guidelines
for Chip Scale Package Section..................................................... 28
Changes to Printed Circuit Board (PCB) Layout Guidelines
Section.............................................................................................. 29
Added Figure 45, Supply Sequencing Section, Thermal Paddle
Design Section, and Figure 46 ...................................................... 29
Added Stencil Design for the Thermal Paddle, Figure 47, and
Figure 48 .......................................................................................... 30
8/08—Rev. 0 to Rev. A
Changes to Features Section ............................................................1
Changes to Loss of Signal/Signal Detect Section ....................... 18
Added Recommended LOS Settings Section.............................. 18
Deleted Figure 39; Renumbered Sequentially ............................ 18
Exposed Paddle Notation Added to Outline Dimensions ........ 31
5/08—Revision 0: Initial Version
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