參數(shù)資料
型號(hào)： ADSP-21060LABZ-160
廠商： Analog Devices Inc
文件頁數(shù)： 46/64頁
文件大小： 0K
描述： IC DSP CONTROLLER 32BIT 225-BGA
產(chǎn)品培訓(xùn)模塊： SHARC Processor Overview
標(biāo)準(zhǔn)包裝： 1
系列： SHARC®
類型： 浮點(diǎn)
接口： 主機(jī)接口，連接端口，串行端口
時(shí)鐘速率： 40MHz
非易失內(nèi)存： 外部
芯片上RAM： 512kB
電壓 - 輸入/輸出： 3.30V
電壓 - 核心： 3.30V
工作溫度： -40°C ~ 85°C
安裝類型： 表面貼裝
封裝/外殼： 225-BBGA
供應(yīng)商設(shè)備封裝： 225-PBGA
包裝： 托盤
Rev. F
|
Page 50 of 64
|
March 2008
ADSP-21060/ADSP-21060L/ADSP-21062/ADSP-21062L/ADSP-21060C/ADSP-21060LC
ENVIRONMENTAL CONDITIONS
The ADSP-2106x processors are rated for performance under
TCASE environmental conditions specified in the Operating Con-
Thermal Characteristics for MQFP_PQ4 and PBGA
Packages
The ADSP-21060/ADSP-21060L and ADSP-21062/ADSP-
21062L are available in 240-lead thermally enhanced
MQFP_PQ4 and 225-ball plastic ball grid array packages. The
top surface of the thermally enhanced MQFP_PQ4 contains a
metal slug from which most of the die heat is dissipated. The
slug is flush with the top surface of the package. Note that the
metal slug is internally connected to GND through the device
substrate.
Both packages are specified for a case temperature (TCASE). To
ensure that the TCASE is not exceeded, a heatsink and/or an air-
flow source may be used. A heatsink should be attached with a
thermal adhesive.
TCASE = TAMB + (PD
u T
CA)
TCASE = Case temperature (measured on top surface of package)
PD =Power dissipation in W (this value depends upon the spe-
cific application; a method for calculating PD is shown under
Power Dissipation).
T
CA =Value from Table 37 below.
Thermal Characteristics for CQFP Package
The ADSP-21060C/ADSP-21060LC are available in 240-lead
thermally enhanced ceramic QFP (CQFP). There are two pack-
age versions, one with a copper/tungsten heat slug on top of the
package (CZ) for air cooling, and one with the heat slug on the
bottom (CW) for cooling through the board. The ADSP-2106x
is specified for a case temperature (TCASE). To ensure that the
TCASE data sheet specification is not exceeded, a heatsink and/or
an air flow source may be used. A heatsink should be attached
with a thermal adhesive.
TCASE = TAMB + (PD
u T
CA)
TCASE = Case temperature (measured on top surface of package)
PD = Power dissipation in W (this value depends upon the spe-
cific application; a method for calculating PD is shown under
Power Dissipation).
T
CA =Value from Table 38 below.
Table 37. Thermal Characteristics for Thermally Enhanced
240-Lead MQFP_PQ41
1 This represents thermal resistance at total power of 5 W. With airflow, no
variance is seen in
T
CA at 5 W.
T
CA at 0 LFM varies with power:
at 2 W,
T
CA = 14°C/W
at 3 W,
T
CA = 11°C/W
Parameter
Airflow (LFM2)
2 LFM = Linear feet per minute of airflow.
Typical
Unit
T
CA
010
°C/W
T
CA
100
9
°C/W
T
CA
200
8
°C/W
T
CA
400
7
°C/W
T
CA
600
6
°C/W
Table 38. Thermal Characteristics for BGA
Parameter
Airflow (LFM1)
1 LFM = Linear feet per minute of airflow.
Typical
Unit
TCA
020.70
°C/W
TCA
200
15.30
°C/W
TCA
400
12.90
°C/W
Table 39. Thermal Characteristics for Thermally Enhanced
240-Lead CQFP1
1 This represents thermal resistance at total power of 5 W. With airflow, no
variance is seen in
T
CA at 5W.
T
CA at 0 LFM varies with power.
ADSP-21060CW/ADSP-21060LCW:
at 2 W,
T
CA = 23°C/W
at 3 W,
T
CA = 21.5°C/W
ADSP-21060CZ/ADSP-21060LCZ:
at 2 W,
T
CA = 24°C/W
at 3 W,
T
CA = 21.5°C/W
T
JC = 0.24°C/W for all CQFP models.
Parameter
Airflow (LFM2)
2 LFM = Linear feet per minute of airflow.
Typical
Unit
ADSP-21060CW/ADSP-21060LCW
T
CA
0
19.5
°C/W
T
CA
100
16
°C/W
T
CA
200
14
°C/W
T
CA
400
12
°C/W
T
CA
600
10
°C/W
ADSP-21060CZ/ADSP-21060LCZ
T
CA
0
20
°C/W
T
CA
100
16
°C/W
T
CA
200
14
°C/W
T
CA
400
11.5
°C/W
T
CA
600
9.5
°C/W
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