參數(shù)資料
型號(hào): ADT7517ARQ
廠商: Analog Devices, Inc.
元件分類: 溫度/濕度傳感器
英文描述: SPI/I2C Compatible, Temperature Sensor, Four Channel ADC and Quad Voltage Output DAC
中文描述: SPI/I2C兼容,溫度傳感器,四通道ADC和四路電壓輸出DAC
文件頁數(shù): 9/44頁
文件大?。?/td> 1350K
代理商: ADT7517ARQ
ADT7516/ADT7517/ADT7519
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
V
DD
to GND
Analog Input Voltage to GND
Digital Input Voltage to GND
Digital Output Voltage to GND
Reference Input Voltage to GND
Operating Temperature Range
Storage Temperature Range
Junction Temperature
16-Lead QSOP Package
Power Dissipation
1
Thermal Impedance
2
θ
JA
Junction-to-Ambient
θ
JC
Junction-to-Case
IR Reflow Soldering
Peak Temperature
Time at Peak Temperature
Ramp-Up Rate
Ramp-Down Rate
Rev. A | Page 9 of 44
Rating
–0.3 V to +7 V
–0.3 V to V
DD
+ 0.3 V
–0.3 V to V
DD
+ 0.3 V
–0.3 V to V
DD
+ 0.3 V
–0.3 V to V
DD
+ 0.3 V
–40°C to +120°C
–65°C to +150°C
150°C
(T
J
max – T
A
)/θ
JA
105.44°C/W
38.8°C/W
220°C (0°C/5°C)
10 sec to 20 sec
2°C/sec to 3°C/sec
–6°C/sec
Table 4. I
2
C Address Selection
ADD Pin
Low
Float
High
I
2
C Address
1001 000
1001 010
1001 011
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
1
Values relate to package being used on a 4-layer board.
2
Junction-to-case resistance is applicable to components featuring a
preferential flow direction, e.g., components mounted on a heat sink.
Junction-to-ambient resistance is more useful for air cooled PCB-mounted
components.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
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