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| 型號： | ADUC7025BSTZ62 |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 99/104頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC MCU FLASH 62K ANLG I/O 64LQFP |
| 產(chǎn)品培訓模塊： | ARM7 Applications & Tools Intro to ARM7 Core & Microconverters |
| 標準包裝： | 1 |
| 系列： | MicroConverter® ADuC7xxx |
| 核心處理器： | ARM7 |
| 芯體尺寸： | 16/32-位 |
| 速度： | 44MHz |
| 連通性： | EBI/EMI，I²C，SPI，UART/USART |
| 外圍設(shè)備： | PLA，PWM，PSM，溫度傳感器，WDT |
| 輸入/輸出數(shù)： | 30 |
| 程序存儲器容量： | 64KB（32K x 16） |
| 程序存儲器類型： | 閃存 |
| RAM 容量： | 2K x 32 |
| 電壓 - 電源 (Vcc/Vdd)： | 2.7 V ~ 3.6 V |
| 數(shù)據(jù)轉(zhuǎn)換器： | A/D 12x12b |
| 振蕩器型： | 內(nèi)部 |
| 工作溫度： | -40°C ~ 125°C |
| 封裝/外殼： | 64-LQFP |
| 包裝： | 托盤 |
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ADuC7019/20/21/22/24/25/26/27/28/29
Data Sheet
Rev. F | Page 94 of 104
GROUNDING AND BOARD LAYOUT
RECOMMENDATIONS
As with all high resolution data converters, special attention
must be paid to grounding and PC board layout of the
ADuC7019/20/21/22/24/25/26/27/28/29-based designs to
achieve optimum performance from the ADCs and DAC.
Although the parts have separate pins for analog and digital
ground (AGND and IOGND), the user must not tie these to
two separate ground planes unless the two ground planes are
connected very close to the part. This is illustrated in the
simplified example shown in Figure 91a. In systems where
digital and analog ground planes are connected together
somewhere else (at the system power supply, for example), the
planes cannot be reconnected near the part because a ground
loop results. In these cases, tie all the ADuC7019/20/21/
22/24/25/26/27/28/29 AGND and IOGND pins to the analog
ground plane, as illustrated in Figure 91b. In systems with only
one ground plane, ensure that the digital and analog components
are physically separated onto separate halves of the board so
that digital return currents do not flow near analog circuitry
(and vice versa).
The ADuC7019/20/21/22/24/25/26/27/28/29 can then be
placed between the digital and analog sections, as illustrated in
04
95
5-
0
47
a.
PLACE ANALOG
COMPONENTS HERE
PLACE DIGITAL
COMPONENTS HERE
AGND
DGND
b.
PLACE ANALOG
COMPONENTS
HERE
PLACE DIGITAL
COMPONENTS HERE
AGND
DGND
c.
PLACE ANALOG
COMPONENTS HERE
PLACE DIGITAL
COMPONENTS HERE
DGND
Figure 91. System Grounding Schemes
In all of these scenarios, and in more complicated real-life
applications, the user should pay particular attention to the flow
of current from the supplies and back to ground. Make sure the
return paths for all currents are as close as possible to the paths
the currents took to reach their destinations.
For example, do not power components on the analog side (as
currents from IOVDD to flow through AGND. Avoid digital
currents flowing under analog circuitry, which can occur if a
noisy digital chip is placed on the left half of the board (shown
in Figure 91c). If possible, avoid large discontinuities in the
ground plane(s) such as those formed by a long trace on the same
layer because they force return signals to travel a longer path.
In addition, make all connections to the ground plane directly,
with little or no trace separating the pin from its via to ground.
When connecting fast logic signals (rise/fall time < 5 ns) to any of
the ADuC7019/20/21/22/24/25/26/27/28/29 digital inputs, add a
series resistor to each relevant line to keep rise and fall times
longer than 5 ns at the part’s input pins. A value of 100 Ω or
200 Ω is usually sufficient to prevent high speed signals from
coupling capacitively into the part and affecting the accuracy
of ADC conversions.
CLOCK OSCILLATOR
The clock source for the ADuC7019/20/21/22/24/25/26/27/28/29
can be generated by the internal PLL or by an external clock
input. To use the internal PLL, connect a 32.768 kHz parallel
resonant crystal between XCLKI and XCLKO, and connect a
capacitor from each pin to ground as shown in Figure 92. The
crystal allows the PLL to lock correctly to give a frequency of
41.78 MHz. If no external crystal is present, the internal
oscillator is used to give a typical frequency of 41.78 MHz ± 3%.
0
495
5-
048
ADuC7026
TO
INTERNAL
PLL
12pF
45
XCLKI
32.768kHz
12pF
44
XCLKO
Figure 92. External Parallel Resonant Crystal Connections
To use an external source clock input instead of the PLL (see
Figure 93), Bit 1 and Bit 0 of PLLCON must be modified.The
external clock uses P0.7 and XCLK.
0
495
5-
049
ADuC7026
TO
FREQUENCY
DIVIDER
XCLKO
XCLKI
XCLK
EXTERNAL
CLOCK
SOURCE
Figure 93. Connecting an External Clock Source
Using an external clock source, the ADuC7019/20/21/22/24/
25/26/27/28/29-specified operational clock speed range is
50 kHz to 44 MHz ± 1%, which ensures correct operation of
the analog peripherals and Flash/EE.
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| ADUC7025BSTZ62-RL | 功能描述:IC MCU 12BIT 1MSPS UART 64-LQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:MicroConverter® ADuC7xxx 標準包裝:38 系列:Encore!® XP® 核心處理器:eZ8 芯體尺寸:8-位 速度:5MHz 連通性:IrDA，UART/USART 外圍設(shè)備:欠壓檢測/復位，LED，POR，PWM，WDT 輸入/輸出數(shù):16 程序存儲器容量:4KB（4K x 8） 程序存儲器類型:閃存 EEPROM 大小:- RAM 容量:1K x 8 電壓 - 電源 (Vcc/Vdd):2.7 V ~ 3.6 V 數(shù)據(jù)轉(zhuǎn)換器:- 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 105°C 封裝/外殼:20-SOIC（0.295"，7.50mm 寬） 包裝:管件 其它名稱:269-4116Z8F0413SH005EG-ND |
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| ADUC7026BST62 | 制造商:AD 制造商全稱:Analog Devices 功能描述:Precision Analog Microcontroller 12-bit Analog I/O, ARM7TDMI MCU |
| ADUC7026BST62-U1 | 制造商:Analog Devices 功能描述: |
| ADUC7026BSTZ62 | 功能描述:IC MCU FLASH 62K W/ANLG 80LQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:MicroConverter® ADuC7xxx 標準包裝:250 系列:56F8xxx 核心處理器:56800E 芯體尺寸:16-位 速度:60MHz 連通性:CAN，SCI，SPI 外圍設(shè)備:POR，PWM，溫度傳感器，WDT 輸入/輸出數(shù):21 程序存儲器容量:40KB（20K x 16） 程序存儲器類型:閃存 EEPROM 大小:- RAM 容量:6K x 16 電壓 - 電源 (Vcc/Vdd):2.25 V ~ 3.6 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 6x12b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 125°C 封裝/外殼:48-LQFP 包裝:托盤 配用:MC56F8323EVME-ND - BOARD EVALUATION MC56F8323 |
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