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參數(shù)資料
| 型號(hào)： | AFBR-5803TZ |
| 英文描述： | FDDI, 100 Mb/s ATM, and Fast Ethernet Transceivers in Low Cost 1 x 9 Package Style |
| 中文描述： | 光纖分布式數(shù)據(jù)介面，100 Mb / s的ATM和快速以太網(wǎng)收發(fā)器的低成本1 × 9封裝形式 |
| 文件頁(yè)數(shù)： | 7/16頁(yè) |
| 文件大?。?/td> | 300K |
| 代理商： | AFBR-5803TZ |
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7
Figure 8. Recommended Board Layout Hole Pattern
Solder and Wash Process
Compatibility
The transceivers are delivered
with protective process plugs
inserted into the duplex SC or
duplex ST connector
receptacle. This process plug
protects the optical
subassemblies during wave
solder and aqueous wash
processing and acts as a dust
cover during shipping.
These transceivers are compat-
ible with either industry
standard wave or hand solder
processes.
Shipping Container
The transceiver is packaged in
a shipping container designed
to protect it from mechanical
and ESD damage during
shipment or storage.
Board Layout - Decoupling Circuit
and Ground Planes
It is important to take care in
the layout of your circuit
board to achieve optimum
performance from these
transceivers. Figure 7 provides
a good example of a schematic
for a power supply decoupling
circuit that works well with
these parts. It is further
recommended that a
contiguous ground plane be
provided in the circuit board
directly under the transceiver
to provide a low inductance
ground for signal return
current. This recommendation
is in keeping with good high
frequency board layout
practices.
Board Layout - Hole Pattern
The Agilent transceiver
complies with the circuit board
“Common Transceiver
Footprint” hole pattern defined
in the original multisource
announcement which defined
the 1 x 9 package style. This
drawing is reproduced in
Figure 8 with the addition of
ANSI Y14.5M compliant
dimensioning to be used as a
guide in the mechanical layout
of your circuit board.
Board Layout - Mechanical
For applications providing a
choice of either a duplex SC
or a duplex ST connector
interface, while utilizing the
same pinout on the printed
circuit board, the ST port
needs to protrude from the
chassis panel a minimum of
9.53 mm for sufficient
clearance to install the ST
connector.
Please refer to Figure 8a for a
mechanical layout detailing the
recommended location of the
duplex SC and duplex ST
transceiver packages in
relation to the chassis panel.
20.32
(0.800)
TOP VIEW
2 x 1.9 ± 0.1
(0.075 ± 0.004)
20.32
(0.800)
2.54
(0.100)
9 x 0.8 ± 0.1
(0.032 ± 0.004)
DIMENSIONS ARE IN MILLIMETERS (INCHES)
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| AFBR-5803Z | FDDI, 100 Mb/s ATM, and Fast Ethernet Transceivers in Low Cost 1 x 9 Package Style |
| AFD1000 | Optoelectronic |
| AFD2000 | Optoelectronic |
| AFD3000 | Optoelectronic |
| AFD5000 | Optoelectronic |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AFBR-5803Z | 功能描述:光纖發(fā)射器、接收器、收發(fā)器 Transceiver RoHS:否 制造商:Omron Electronics 產(chǎn)品:Transmitters 數(shù)據(jù)速率:3.5 Gbps 波長(zhǎng):850 nm 最大工作溫度: 最小工作溫度: 封裝 / 箱體: 封裝: |
| AFBR-5805ATZ | 功能描述:光纖發(fā)射器、接收器、收發(fā)器 Transceiver RoHS:否 制造商:Omron Electronics 產(chǎn)品:Transmitters 數(shù)據(jù)速率:3.5 Gbps 波長(zhǎng):850 nm 最大工作溫度: 最小工作溫度: 封裝 / 箱體: 封裝: |
| AFBR-5805AZ | 功能描述:光纖發(fā)射器、接收器、收發(fā)器 Transceiver RoHS:否 制造商:Omron Electronics 產(chǎn)品:Transmitters 數(shù)據(jù)速率:3.5 Gbps 波長(zhǎng):850 nm 最大工作溫度: 最小工作溫度: 封裝 / 箱體: 封裝: |
| AFBR-5805TZ | 功能描述:光纖發(fā)射器、接收器、收發(fā)器 Transceiver RoHS:否 制造商:Omron Electronics 產(chǎn)品:Transmitters 數(shù)據(jù)速率:3.5 Gbps 波長(zhǎng):850 nm 最大工作溫度: 最小工作溫度: 封裝 / 箱體: 封裝: |
| AFBR-5805Z | 功能描述:光纖發(fā)射器、接收器、收發(fā)器 Transceiver RoHS:否 制造商:Omron Electronics 產(chǎn)品:Transmitters 數(shù)據(jù)速率:3.5 Gbps 波長(zhǎng):850 nm 最大工作溫度: 最小工作溫度: 封裝 / 箱體: 封裝: |
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