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參數(shù)資料
| 型號： | AG303-63G |
| 廠商： | TRIQUINT SEMICONDUCTOR INC |
| 元件分類： | 放大器 |
| 英文描述： | 0 MHz - 6000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| 封裝： | GREEN, PLASTIC, MO-203, SOT-363, SMT, 6 PIN |
| 文件頁數(shù)： | 5/5頁 |
| 文件大?。?/td> | 508K |
| 代理商： | AG303-63G |
Specifications and information are subject to change without notice
TriQuint Semiconductor, Inc
Phone +1-503-615-9000
FAX: +1-503-615-8900
e-mail: info-sales@tqs.com
Web site: www.TriQuint.com
Page 5 of 5
August 2009
AG303-63
InGaP HBT Gain Block
Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 C reflow temperature) and leaded
(maximum 245 C reflow temperature) soldering processes. The plating material on the leads is annealed matte tin over copper.
Outline Drawing
JXX
Land Pattern
Product Marking
The component will be marked with a “J”
designator followed by a two-digit numeric lot
code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
ESD Rating: Class 1C
Value:
Passes
1000V min.
Test:
Human Body Model (HBM)
Standard:
JEDEC Standard JESD22-A114
ESD Rating: Class IV
Value:
Passes
1000V min.
Test:
Charged Device Model (CDM)
Standard:
JEDEC Standard JESD22-C101
MSL Rating: Level 3 at +260 C convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper
performance of this device.
Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated thru
diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers
near the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the
board to a heatsink. Ensure that the ground / thermal via
region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in
the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in
degrees.
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相關代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AG303-63PCB | 功能描述:射頻開發(fā)工具 700-2400MHz Eval Brd 14dBm 20dB Gain RoHS:否 制造商:Taiyo Yuden 產(chǎn)品:Wireless Modules 類型:Wireless Audio 工具用于評估:WYSAAVDX7 頻率: 工作電源電壓:3.4 V to 5.5 V |
| AG303-63TRG | 制造商:TriQuint Semiconductor 功能描述:GAIN BLOCK 制造商:TriQuint Semiconductor 功能描述:AG303-63TRG |
| AG303-86 | 制造商:WJCI 制造商全稱:WJCI 功能描述:InGaP HBT Gain Block |
| AG303-86G | 功能描述:射頻放大器 DC-6000MHz 20.5dB Gain@900MHz RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點:37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| AG303-86PCB | 功能描述:射頻開發(fā)工具 700-2400MHz Eval Brd 14dBm 20dB Gain RoHS:否 制造商:Taiyo Yuden 產(chǎn)品:Wireless Modules 類型:Wireless Audio 工具用于評估:WYSAAVDX7 頻率: 工作電源電壓:3.4 V to 5.5 V |
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