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參數(shù)資料
| 型號： | AG606 |
| 元件分類： | 放大器 |
| 英文描述： | 50 MHz - 860 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| 封裝： | PLASTIC, MS-012, SOIC-8 |
| 文件頁數(shù)： | 5/6頁 |
| 文件大小： | 503K |
| 代理商： | AG606 |
Specifications and information are subject to change without notice.
WJ Communications, Inc
¤
Phone 1-800-WJ1-4401
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FAX: 408-577-6621
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e-mail: sales@wj.com
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Web site: www.wj.com
Page 5 of 6
July 2005
The Communications Edge TM
AG606
Push-Pull CATV Amplifier
Product Information
AG606 (SOIC-8 Package) Mechanical Information
This package may contain lead-bearing materials. The plating material on the leads is SnPb.
Outline Drawing
Land Pattern
Thermal Specifications
Parameter
Rating
Operating Case Temperature
-40 to +85
q C
Thermal Resistance, Rth (1)
63
q C/W
Junction Temperature, Tjc (2)
142
q C
Notes:
1. The thermal resistance is referenced from the hottest
part of the junction to ground tab.
2. This corresponds to the typical biasing condition of
+5.16V, 175 mA at an 85 C case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 177 C.
Product Marking
The component will be marked with an
“AG606” designator with an alphanumeric lot
code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD / MSL Information
ESD Rating: Class 1C
Value:
1000 to 2000 V
Test:
Human Body Model (HBM)
Standard:
JEDEC Standard JESD22-A114
ESD Rating: Class IV
Value
1000 V
Test:
Charge Device Model (CDM)
Standard:
JEDEC Standard JESD22-C101
MSL Rating: Level 1 at +235 C convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the
proper performance of this device.
Vias
should use a .35mm (#80 / .0135” ) diameter
drill and have a final plated thru diameter of
.25 mm (.010” ).
2. Add as much copper as possible to inner and
outer layers near the part to ensure optimal
thermal performance.
3. Mounting screws can be added near the part
to fasten the board to a heatsink. Ensure that
the ground / thermal via region contacts the
heatsink.
4. Do not put solder mask on the backside of the
PC board in the region where the board
contacts the heatsink.
5. RF trace width depends upon the PC board
material and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches).
Angles are in degrees.
MTTF vs. GND Tab Temperature
1
10
100
1000
10000
50
60
70
80
90
100
Tab Temperature (°C)
M
T
F
(M
il
li
o
n
H
rs
)
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AG606-G | 功能描述:射頻放大器 50-860MHz +/-0.7dB Gain RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| AG606-PCB | 功能描述:射頻開發(fā)工具 Push-Pull Eval Brd 14dB Gain RoHS:否 制造商:Taiyo Yuden 產(chǎn)品:Wireless Modules 類型:Wireless Audio 工具用于評估:WYSAAVDX7 頻率: 工作電源電壓:3.4 V to 5.5 V |
| AG606-S8TRG | 制造商:TriQuint Semiconductor 功能描述:BROADBAND/CATV (75 OHM) MISC. AMPLIFIER |
| AG60P-5 | 功能描述:SINGLE O/P, DC-HV DC PCB MOUNT, 制造商:xp power 系列:XP EMCO - AG 包裝:盒 零件狀態(tài):有效 類型:高電壓 - 隔離模塊 輸出數(shù):1 電壓 - 輸入（最小值）:0.7V 電壓 - 輸入（最大值）:5V 電壓 - 輸出 1:6000V 電壓 - 輸出 2:- 電壓 - 輸出 3:- 電流 - 輸出（最大值）:1.67mA 功率（W） - 制造系列:1W 電壓 - 隔離:500V 應(yīng)用:ITE（商業(yè)） 特性:SCP 安裝類型:表面貼裝 封裝/外殼:5-SMD 模塊 大小/尺寸:1.13" 長 x 0.45" 寬 x 0.25" 高（28.7mm x 11.4mm x 6.4mm） 工作溫度:-25°C ~ 75°C 效率:- 功率（W） - 最大值:1W 標(biāo)準(zhǔn)包裝:1 |
| AG611 | 制造商:CIF 功能描述:TINNER COPPER PADS 1 SIDE 100X160MM 制造商:CIF 功能描述:TINNER COPPER PADS 1 SIDE 100X160MM; Board Material:Epoxy; External Height:160mm; External Width:160mm; Board Connector / Footprint:DIN41612; SVHC:No SVHC (19-Dec-2012); External Length / Height:160mm; Material:Epoxy 16/10; PCB Hole ;RoHS Compliant: Yes |
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